Refer to the DLPC231-Q1 and TPS99001-Q1 data sheets for specific PCB layout and routing guidelines. For specific DMD PCB guidelines, use the following:

• Match lengths for the LS_WDATA and LS_CLK signals
• Minimize vias, layer changes, and turns for the HS bus signals
• Minimum of two 220nF decoupling capacitors close to VBIAS
• Minimum of two 220nF decoupling capacitors close to VRESET
• Minimum of three 4.7μF decoupling capacitors close to VOFFSET
• Minimum of four 100nF decoupling capacitors close to VDDI and VDD
• Temperature diode pins

  The DMD has an internal diode (PN junction) that is intended to be used with an external TI TMP411 temperature sensing IC. PCB traces from the DMD’s temperature diode pins to the TMP411 are sensitive to noise. See the TMP411 ±1°C Remote and Local Temperature Sensor with N-Factor and Series Resistance Correction Data Sheet for specific routing recommendations.