Thermal resistance, active area to test point 1 (TP1)(1)
0.90
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the
package. The cooling system must be capable of
maintaining the package within the temperature
range specified in the Recommended Operating Conditions. The total heat load on
the DMD is largely driven by the incident light
absorbed by the active area; although other
contributions include light energy absorbed by the
window aperture and electrical power dissipation
of the array.
Optical systems
must
be designed to minimize the light energy falling
outside the window clear aperture since any
additional thermal load in this area can
significantly degrade the reliability of the
device.