ZHCSQC3B april 2019 – march 2023 DLP470TE
PRODUCTION DATA
Over operating free-air temperature range (unless otherwise noted). Stresses beyond those listed under Section 6.1 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device is not implied at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure above or below the Recommended Operating Conditions. Exposure above or below the Recommended Operating Conditions for extended periods may affect device reliability.
MIN | MAX | UNIT | ||
---|---|---|---|---|
SUPPLY VOLTAGES | ||||
VCC | Supply voltage for LVCMOS core logic(1) | –0.5 | 2.3 | V |
VOFFSET | Supply voltage for HVCMOS and micromirror electrode(1)(2) | –0.5 | 11 | V |
VBIAS | Supply voltage for micromirror electrode(1) | –0.5 | 19 | V |
VRESET | Supply voltage for micromirror electrode(1) | –15 | –0.3 | V |
|VBIAS – VOFFSET| | Supply voltage difference (absolute value)(3) | 11 | V | |
|VBIAS – VRESET| | Supply voltage difference (absolute value)(4) | 34 | V | |
INPUT VOLTAGES | ||||
Input voltage for all other LVCMOS input pins(1) | –0.5 | VCC + 0.5 | V | |
Input voltage for all other LVDS input pins (1)(5) | –0.5 | VCC + 0.5 | V | |
|VID| | Input differential voltage (absolute value)(6) | 500 | mV | |
IID | Input differential current(5) | 6.3 | mA | |
Clocks | ||||
ƒCLOCK | Clock frequency for LVDS interface, DCLK_A | 400 | MHz | |
ƒCLOCK | Clock frequency for LVDS interface, DCLK_B | 400 | MHz | |
ƒCLOCK | Clock frequency for LVDS interface, DCLK_C | 400 | MHz | |
ƒCLOCK | Clock frequency for LVDS interface, DCLK_D | 400 | MHz | |
ENVIRONMENTAL | ||||
TARRAY and TWINDOW | Temperature, operating(7) | 0 | 90 | °C |
Temperature, non–operating(7) | –40 | 90 | °C | |
|TDELTA| | Absolute temperature delta between any point on the window edge and the ceramic test point TP1 (8) | 30 | °C | |
TDP | Dew point temperature, operating and non–operating (non-condensing) | 81 | °C |