ZHCSQC3B april 2019 – march 2023 DLP470TE
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Capacitance at Recommended Operating Conditions
- 6.8 Timing Requirements
- 6.9 System Mounting Interface Loads
- 6.10 Micromirror Array Physical Characteristics
- 6.11 Micromirror Array Optical Characteristics
- 6.12 Window Characteristics
- 6.13 Chipset Component Usage Specification
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
6.10 Micromirror Array Physical Characteristics
Table 6-2 Micromirror Array Physical Characteristics
| PARAMETER DESCRIPTION | VALUE | UNIT | |
|---|---|---|---|
| Number of active columns (1) | M | 1920 | micromirrors |
| Number of active rows (1) | N | 1080 | micromirrors |
| Micromirror (pixel) pitch (1) | P | 5.4 | µm |
| Micromirror active array width (1) | Micromirror pitch × number of active columns | 10.368 | mm |
| Micromirror active array height (1) | Micromirror pitch × number of active rows | 5.832 | mm |
| Micromirror active border (top / bottom) (2) | Pond of micromirrors (POM) | 80 | micromirrors/side |
| Micromirror active border (right / left) (2) | Pond of micromirrors (POM) | 84 | micromirrors/side |
(1) See Figure 6-8.
(2) The structure and qualities of the border around the active
array includes a band of partially functional micromirrors referred to as the
pond of micromirrors (POM).
These
micromirrors are prevented from tilting toward the bright or “on” state but
still require an electrical bias to tilt toward “off.”
Figure 6-8 Micromirror Array Physical CharacteristicsRefer to section Micromirror Array Physical Characteristics table for M, N, and P specifications.