ZHCSJ13B
November 2018 – May 2022
DLP4710
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Switching Characteristics
6.9
System Mounting Interface Loads
6.10
Physical Characteristics of the Micromirror Array
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
6.14
Software Requirements
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Low-Speed Interface
7.3.3
High-Speed Interface
7.3.4
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Optical Interface and System Image Quality
7.5.1.1
Numerical Aperture and Stray Light Control
7.5.1.2
Pupil Match
7.5.1.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On and Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
9.1
DMD Power Supply Power-Up Procedure
9.2
DMD Power Supply Power-Down Procedure
9.3
Power Supply Sequencing Requirements
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
第三方米6体育平台手机版_好二三四免责声明
11.1.2
Device Nomenclature
11.1.3
Device Markings
11.2
Related Links
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FQL|100
MCLG032C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsj13b_oa
zhcsj13b_pm
1
特性
0.47 英寸 (11.93mm) 对角线微镜阵列
1920 × 1080 铝制微米级微镜阵列,采用正交布局
微镜间距:5.4μm
微镜倾斜(相对于平坦表面):±17°
底部照明,实现最优的效率和光学引擎尺寸
偏振无关型铝微镜表面
32 位 SubLVDS 输入数据总线
专用 DLP3439 显示控制器
专用 DLPA3000 或 DLPA3005 PMIC/LED 驱动器确保可靠运行
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