ZHCSLB6C may   2020  – july 2023 DLP4710LC

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
    14. 6.14 Software Requirements
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
        1. 7.5.1.1 Numerical Aperture and Stray Light Control
        2. 7.5.1.2 Pupil Match
        3. 7.5.1.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On and Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1.      46
      2. 8.2.1 Design Requirements
      3. 8.2.2 Detailed Design Procedure
      4. 8.2.3 Application Curve
  10. Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Related Links
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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订购信息

Absolute Maximum Ratings

see (1)
MINMAXUNIT
Supply voltageVDDSupply voltage for LVCMOS core logic(2)
Supply voltage for LPSDR low speed interface
–0.52.3V
VDDISupply voltage for SubLVDS receivers(2)–0.52.3V
VOFFSETSupply voltage for HVCMOS and micromirror electrode(2) (3)–0.511V
VBIASSupply voltage for micromirror electrode(2)–0.519V
VRESETSupply voltage for micromirror electrode(2)–150.5V
| VDDI–VDD |Supply voltage delta (absolute value)(4)0.3V
| VBIAS–VOFFSET |Supply voltage delta (absolute value)(5)11V
| VBIAS–VRESET |Supply voltage delta (absolute value)(6)34V
Input voltageInput voltage for other inputs LPSDR(2)–0.5VDD + 0.5V
Input voltage for other inputs SubLVDS(2) (7)–0.5VDDI + 0.5V
Input pins| VID |SubLVDS input differential voltage (absolute value)(7)810mV
IIDSubLVDS input differential current10mA
Clock frequencyƒclockClock frequency for low speed interface LS_CLK130MHz
ƒclockClock frequency for high speed interface DCLK620MHz
EnvironmentalTARRAY and TWINDOWTemperature – operational (8)–2090°C
Temperature – non-operational(8)–4090°C
TDPDew Point Temperature - operating and non-operating (non-condensing)81°C
|TDELTA|Absolute Temperature delta between any point on the window edge and the ceramic test point TP1(9)30°C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
All voltage values are with respect to the ground terminals (VSS). The following power supplies are all required to operate the DMD: VDD, VDDI, VOFFSET, VBIAS, and VRESET. All VSS connections are also required.
VOFFSET supply transients must fall within specified voltages.
Exceeding the recommended allowable absolute voltage difference between VDDI and VDD may result in excessive current draw.
Exceeding the recommended allowable absolute voltage difference between VBIAS and VOFFSET may result in excessive current draw.
Exceeding the recommended allowable absolute voltage difference between VBIAS and VRESET may result in excessive current draw.
This maximum input voltage rating applies when each input of a differential pair is at the same voltage potential. Sub-LVDS differential inputs must not exceed the specified limit or damage may result to the internal termination resistors.
The highest temperature of the active array (as calculated by the Section 7.6) or of any point along the Window Edge as defined in Figure 7-1. The locations of thermal test points TP2, TP3, TP4, and TP5 in Figure 7-1 are intended to measure the highest window edge temperature. If a particular application causes another point on the window edge to be at a higher temperature, that point should be used.
Temperature delta is the highest difference between the ceramic test point 1 (TP1) and anywhere on the window edge as shown in Figure 7-1. The window test points TP2, TP3, TP4, and TP5 shown in Figure 7-1 are intended to result in the worst case delta. If a particular application causes another point on the window edge to result in a larger delta temperature, that point should be used.