Thermal Resistance, active area to test point 1 (TP1)(1)
0.8
°C/W
(1) The DMD is designed to conduct absorbed and
dissipated heat to the back of the package. The
cooling system must be capable of maintaining the
DMD within the temperature range specified in
Section 6.4. The total heat load on the DMD is largely
driven by the incident light absorbed by the
active area; although other contributions include
light energy absorbed by the window aperture and
electrical power dissipation of the array. Optical
systems should be designed to minimize the light
energy falling outside the window clear aperture
since any additional thermal load in this area can
significantly degrade the reliability of the
device.