The DMD features a built-in thermal diode that measures the temperature at one corner of the die outside the micromirror array. The thermal diode can be interfaced with the TMP411 temperature sensor as shown in Figure 8-4. The software application contains functions to configure the TMP411 to read the DLP471TE DMD temperature sensor diode. This data can be leveraged by the customer to incorporate additional functionality in the overall system design such as adjusting illumination, fan speeds, etc. All communication between the TMP411 and the DLPC7540 controller happens over the I²C interface. The TMP411 connects to the DMD via pins outlined in Table 5-1.

If the temp sensor is not used, TEMP_N and TEMP_P pins should be left unconnected (NC).

A. Details omitted for clarity.

B. See the TMP411 datasheet for system board layout recommendation.

C. See the TMP411 datasheet and the TI reference design for suggested component values for R1, R2, R3, R4, and C1.

D. R5 = 0 Ω. R6 = 0 Ω. Place 0-Ω resistors close to the DMD package pins.

Figure 8-4 TMP411 Sample Schematic