Thermal Resistance, active area to test point 1 (TP1)(1)
0.8
°C/W
(1) The DMD is designed to
conduct absorbed and dissipated heat to the back of the package. The cooling
system must be capable of maintaining the DMD within the temperature range
specified in the
Recommended Operating Conditions. The
total heat load on the DMD is largely driven by the incident light absorbed by
the active area; although other contributions include light energy absorbed by
the window aperture and electrical power dissipation of the array. Optical
systems should be designed to minimize the light energy falling outside the
window clear aperture since any additional thermal load in this area can
significantly degrade the reliability of the device.