ZHCSO64C September 2020 – January 2025 DLP471TE
PRODUCTION DATA
The layer stack-up and copper weight for each layer is shown in Table 9-2.
| LAYER NO. | LAYER NAME | COPPER WT. (oz.) | COMMENTS |
|---|---|---|---|
| 1 | Side A – DMD, primary components, power mini-planes | 0.5oz (before plating) | DMD and escapes. Two data input connectors. Top components including power generation and two data input connectors. Low-frequency signals routing. Use copper fill (GND) plated up to 1oz. |
| 2 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #1, 3 |
| 3 | Signal (High frequency) | 0.5 | High-speed signal layer. High-speed differential data buses from input connector to DMD. |
| 4 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #3, #5 |
| 5 | Power | 0.5 | Primary split power planes for 1.8V, 3.3V, 10V, –14V, 18V |
| 6 | Power | 0.5 | Primary split power planes for 1.8V, 3.3 V, 10V, –14V, 18V |
| 7 | Ground | 0.5 | Solid ground plane (net GND) Reference for signal layer #8 |
| 8 | Signal (high frequency) | 0.5 | High-speed signal layer. High-speed differential data buses from the input connector to DMD |
| 9 | Ground | 0.5 | Solid ground plane (net GND) Reference for signal layers #8, 10 |
| 10 | Side B—Secondary components, power mini-planes | 0.5oz (before plating) | Discrete components if necessary. Low-frequency signals routing. Use copper fill plated up to 1oz. |