TI strongly discourages signal routing on power planes or on planes adjacent to power planes. If signals must be routed on layers adjacent to power planes, they must not cross splits in power planes to prevent EMI and preserve signal integrity.

Have all internal digital ground (GND) planes connected together in as many places as possible. If possible, all internal ground planes should be connected together with a minimum distance between connections of 0.5”. Extra vias may not be required if there are sufficient ground vias due to normal ground connections of devices.

The power and ground pins of each component should be connected to the power and ground planes with at least one via for each pin. Trace lengths for component power and ground pins should be minimized (ideally, less than 0.100”).

Ground plane slots are strongly discouraged.