ZHCSNH4B august 2020 – july 2023 DLP471TP
PRODUCTION DATA
The layer stack-up and copper weight for each layer is shown in Table 10-2.
| LAYER NO. | LAYER NAME | COPPER WT. (oz.) | COMMENTS |
|---|---|---|---|
| 1 | Side A – DMD, primary components, power mini-planes | 0.5 oz. (before plating) | DMD and escapes. Two data input connectors. Top components including power generation and two-data input connectors. Low frequency signals routing. Should have copper fill (GND) plated up to 1 oz. |
| 2 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #1, 3 |
| 3 | Signal (high frequency) | 0.5 | High-speed signal layer. High-speed differential data buses from input connector to DMD. |
| 4 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #3, #5 |
| 5 | Power | 0.5 | Primary split power planes for 1.8 V, 10 V, –14 V, 18 V |
| 6 | Power | 0.5 | Primary split power planes for 1.8 V, 10 V, –14 V, 18 V |
| 7 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layer #8 |
| 8 | Signal (high frequency) | 0.5 | High-speed signal layer. High-speed differential data buses from input connector to DMD |
| 9 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #8, 10 |
| 10 | Side B –secondary components, power mini-planes | 0.5 oz. (before plating) | Discrete components if necessary. Low-frequency signals routing. Should have copper fill plated up to 1 oz. |