Thermal Resistance, active area to test point 1 (TP1)(1)
1.0
°C/W
(1) The DMD is designed to conduct absorbed and
dissipated heat to the back of the package. The
cooling system must be capable of maintaining the
package within the temperature range specified in
the Section 6.4. The total heat load on the
DMD is largely driven by the
incident light absorbed by the active area;
although other contributions include light energy
absorbed by the
window aperture and electrical
power dissipation of the array. Optical systems
should be designed to minimize the light energy falling
outside the window clear
aperture since any additional thermal load in this
area can significantly degrade the reliability of
the device.