ZHCSN33B November 2017 – February 2023 DLP550JE
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Timing Requirements
- 6.8 Window Characteristics
- 6.9 System Mounting Interface Loads
- 6.10 Micromirror Array Physical Characteristics
- 6.11 Micromirror Array Optical Characteristics
- 6.12 Chipset Component Usage Specification
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
6.11 Micromirror Array Optical Characteristics
| PARAMETER | MIN | NOM | MAX | UNIT | |
|---|---|---|---|---|---|
| Micromirror tilt angle, variation device to device #DLPS08581#T4989946-28#T4989946-29#DLPS08583 | 11 | 12 | 13 | degrees | |
| Number of out-of-specification micromirrors #DLPS08584 | Adjacent micromirrors | 0 | micromirrors | ||
| Non-adjacent micromirrors | 10 |
(1) Measured relative to the plane formed by the overall micromirror array.
(2) Variation can occur between any two individual
micromirrors
located on the same device or located on different devices.
(3) Additional variation exists between the micromirror array and the package datums. See package drawing.
(4) See #DLPS1017592.
(5) An out-of-specification micromirror is defined as a micromirror that is unable to transition between the two landed states.
Refer to section Micromirror Array Physical Characteristics table for M, N, and P specifications.
Figure 6-12 Micromirror Landed Orientation and Tilt