ZHCSN33B November   2017  – February 2023 DLP550JE

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Power Interface
      2. 7.2.2 Timing
    3. 7.3 Optical Interface and System Image Quality Considerations
      1. 7.3.1 Numerical Aperture and Stray Light Control
      2. 7.3.2 Pupil Match
      3. 7.3.3 Illumination Overfill
    4. 7.4 Micromirror Array Temperature Calculation
      1. 7.4.1 Micromirror Array Temperature Calculation
    5. 7.5 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.5.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.5.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.5.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.5.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 10.1.2 Device Nomenclature
      3. 10.1.3 Device Markings
    2. 10.2 支持资源
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1 DMD Power-Up and Power-Down Procedures

The DLP550JE power-up and power-down procedures are defined by the DLPC4430 data sheet. The power supply guidelines are defined in the DLPA200 DMD Micromirror Driver Data Sheet. These procedures must be followed to ensure reliable operation of the device.

CAUTION:

For reliable operation of the DMD, the following power supply sequencing requirements must be followed. Failure to adhere to the prescribed power-up and power-down procedures may affect device reliability. VCC, VCCI, VOFFSET, and VMBRST power supplies have to be coordinated during power-up and power-down operations. VSS must also be connected. Failure to meet any of these requirements results in a significant reduction in the DMD’s reliability and lifetime.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |