ZHCSN33B November   2017  – February 2023 DLP550JE

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Power Interface
      2. 7.2.2 Timing
    3. 7.3 Optical Interface and System Image Quality Considerations
      1. 7.3.1 Numerical Aperture and Stray Light Control
      2. 7.3.2 Pupil Match
      3. 7.3.3 Illumination Overfill
    4. 7.4 Micromirror Array Temperature Calculation
      1. 7.4.1 Micromirror Array Temperature Calculation
    5. 7.5 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.5.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.5.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.5.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.5.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 10.1.2 Device Nomenclature
      3. 10.1.3 Device Markings
    2. 10.2 支持资源
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Timing

The data sheet provides timing analysis as measured at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be considered. GUID-99C25A6A-6E1F-4AA2-94E4-BF3E57D3C09A.html#T4989946-26 shows an equivalent test load circuit for the output under test. Timing reference loads are not intended as a precise representation of any particular system environment or depiction of the actual load presented by a production test. TI suggests that system designers use IBIS or other simulation tools to correlate the timing reference load to a system environment. The load capacitance value stated is only for characterization and measurement of AC timing signals. This load capacitance value does not indicate the maximum load the device is capable of driving.