ZHCSPA1 February   2022 DLP5531A-Q1

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5.     11
   6. 6.5  Thermal Information
   7. 6.6  Electrical Characteristics
   8. 6.7  Timing Requirements
   9.     15
   10. 6.8  Switching Characteristics
   11.     17
   12. 6.9  System Mounting Interface Loads
   13.     19
   14. 6.10 Physical Characteristics of the Micromirror Array
   15.     21
   16. 6.11 Micromirror Array Optical Characteristics
   17. 6.12 Window Characteristics
   18. 6.13 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Sub-LVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
         1. 7.3.5.1 Temperature Sense Diode Theory
   4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
   5. 7.5 DMD Image Performance Specification
   6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Temperature Rise Through the Package for Heatsink Design
      2. 7.6.2 Monitoring Array Temperature Using the Temperature Sense Diode
   7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
9. 9 Power Supply Recommendations
   1. 9.1 Power Supply Power-Up Procedure
   2. 9.2 Power Supply Power-Down Procedure
   3. 9.3 Power Supply Sequencing Requirements
10. 10Layout
    1. 10.1 Layout Guidelines
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Device Nomenclature
       2. 11.1.2 Device Markings
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 DMD Handling
    7. 11.7 术语表
12. 12Mechanical, Packaging, and Orderable Information