ZHCSD21 October   2014 DLP6500FLQ

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 修订历史记录
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Handling Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics
   6. 6.6  Timing Requirements
   7. 6.7  Typical Characteristics
   8. 6.8  System Mounting Interface Loads
   9. 6.9  Micromirror Array Physical Characteristics
   10. 6.10 Micromirror Array Optical Characteristics
   11. 6.11 Window Characteristics
   12. 6.12 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
   4. 7.4 Device Functional Modes
   5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
   6. 7.6 Micromirror Array Temperature Calculation
   7. 7.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
9. 9 Power Supply Recommendations
   1. 9.1 DMD Power Supply Requirements
   2. 9.2 DMD Power Supply Power-Up Procedure
   3. 9.3 DMD Power Supply Power-Down Procedure
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 General PCB Recommendations
    2. 10.2 Layout Example
       1. 10.2.1 Board Stack and Impedance Requirements
          1. 10.2.1.1 Power Planes
          2. 10.2.1.2 LVDS Signals
          3. 10.2.1.3 Critical Signals
          4. 10.2.1.4 Flex Connector Plating
          5. 10.2.1.5 Device Placement
          6. 10.2.1.6 Device Orientation
          7. 10.2.1.7 Fiducials
11. 11器件和文档支持
    1. 11.1 器件支持
       1. 11.1.1 器件命名规则
       2. 11.1.2 器件标记
    2. 11.2 文档支持
       1. 11.2.1 相关文档　
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
12. 12机械封装和可订购信息