ZHCSD23A October 2014 – February 2016 DLP6500FYE
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 修订历史记录
- 5 Pin Configuration and Functions
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6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Timing Requirements
- 6.8 Typical Characteristics
- 6.9 System Mounting Interface Loads
- 6.10 Micromirror Array Physical Characteristics
- 6.11 Micromirror Array Optical Characteristics
- 6.12 Window Characteristics
- 6.13 Chipset Component Usage Specification
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件文档支持
- 12机械、封装和可订购信息
11 器件文档支持
11.1 器件支持
11.1.1 器件命名规则
Table 9. 封装具体信息
| 封装类型 | 引脚 | 连接器 |
|---|---|---|
| FYE | 350 | PGA |
Figure 19. 器件型号 说明
11.1.2 器件标记
器件标记将包括可读信息和一个二维矩阵码。Figure 20 中显示了可读信息。二维矩阵码是一个字母数字字符串，其中包含 DMD 部件号、序列号的第 1 部分和序列号的第 2 部分。DMD 序列号（第 1 部分）的首字符为制造年份。DMD 序列号（第 1 部分）的第二个字符为制造月份。DMD 序列号（第 2 部分）的最后一个字符为偏置电压二进制字母。
Figure 20. DMD 标记
11.2 文档支持
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.4 商标
DLP, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.