ZHCSN34A November 2017 – February 2023 DLP650LE
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Capacitance at Recommended Operating Conditions
- 6.8 Timing Requirements
- 6.9 Window Characteristics
- 6.10 System Mounting Interface Loads
- 6.11 Micromirror Array Physical Characteristics
- 6.12 Micromirror Array Optical Characteristics
- 6.13 Chipset Component Usage Specification
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
10.2.2 Device Markings
The device marking will include both human-readable information and a 2-dimensional matrix code. The human-readable information is described in Figure 10-2. The 2-dimensional matrix code is an alpha-numeric character string that contains the DMD part number, Part 1 of Serial Number, and Part 2 of Serial Number. The first character of the DMD Serial Number (part 1) is the manufacturing year. The second character of the DMD Serial Number (part 1) is the manufacturing month. The last character of the DMD Serial Number (part 2) is the bias voltage bin letter.
Example: *1280-643AB GHXXXXX LLLLLLM
Figure 10-2 DMD Marking Locations