ZHCSN34A November 2017 – February 2023 DLP650LE
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Capacitance at Recommended Operating Conditions
- 6.8 Timing Requirements
- 6.9 Window Characteristics
- 6.10 System Mounting Interface Loads
- 6.11 Micromirror Array Physical Characteristics
- 6.12 Micromirror Array Optical Characteristics
- 6.13 Chipset Component Usage Specification
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
6.11 Micromirror Array Physical Characteristics
Table 6-3 Micromirror Array Physical Characteristics
| PARAMETER DESCRIPTION | VALUE | UNIT | |
|---|---|---|---|
| Number of active columns(1) | M | 1280 | micromirrors |
| Number of active rows(1) | N | 800 | |
| Micromirror (pixel) pitch (1) | P | 10.8 | µm |
| Micromirror active array width(1) | Micromirror pitch × number of active columns | 13.824 | mm |
| Micromirror active array height(1) | Micromirror pitch × number of active rows | 8.640 | mm |
| Micromirror active border size(2) | Pond of Micromirror (POM) | 10 | micromirrors / side |
(1) See Figure 6-8.
(2) The structure and qualities of the border around the active array includes a band of partially functional micromirrors called the Pond Of Mirrors (POM). These micromirrors are structurally and/or electrically prevented from tilting toward the bright or “on” state but still require an electrical bias to tilt toward “off.”
Figure 6-8 Micromirror Array Physical CharacteristicsRefer to Section 6.11 table for M, N, and P specifications.