(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of maintaining the package within the temperature range specified in the Recommended Operating Conditions.
The total heat load on the DMD is largely driven by the incident light absorbed by the micromirrror array, although other contributions include light energy outside of the active mirror array and electrical power dissipation of the silicon.
Design the optical system to minimized light outside of the active micromirror array because light outside of this area gets highly absorbed by the optical border and increases DMD heat load.
Design the optical system to minimize the light energy falling outside the window clear aperture. Aditional thermal load in this area contributes to window heating and significantly degrades the reliability of the device.