ZHCSRS7A August 2017 – February 2023 DLP650NE
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
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6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Timing Requirements
- 6.8 Window Characteristics
- 6.9 System Mounting Interface Loads
- 6.10 Micromirror Array Physical Characteristics
- 6.11 Micromirror Array Optical Characteristics
- 6.12 Chipset Component Usage Specification
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7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 7.5 Optical Interface and System Image Quality Considerations
- 7.6 Micromirror Array Temperature Calculation
- 7.7 Micromirror Landed-On or Landed-Off Duty Cycle
- 8 Power Supply Requirements
- 9 Device Documentation Support
- 10Mechanical, Packaging, and Orderable Information
9.2.2 Device Markings
The device marking will include both human-readable information and a 2-dimensional matrix code. The human- readable information is described in Figure 9-2. The 2-dimensional matrix code is an alpha-numeric character string that contains the DMD part number, Part 1 of Serial Number, and Part 2 of Serial Number. The first character of the DMD Serial Number (part 1) is the manufacturing year. The second character of the DMD Serial Number (part 1) is the manufacturing month. The last character of the DMD Serial Number (part 2) is the bias voltage bin letter.
Examples: *1910–623AE GHXXXXX LLLLLLM
Figure 9-2 DMD Marking