ZHCSN28A March 2021 – May 2022 DLP651NE
PRODUCTION DATA
Table 10-2 shows the layer stack-up and copper weight for each layer.
| LAYER NO. | LAYER NAME | COPPER WT. (oz.) | COMMENTS |
|---|---|---|---|
| 1 | Side A—DMD, primary components, power mini-planes | 0.5 oz. (before plating) | DMD and escapes. Two data input connectors. Top components including power generation and two data input connectors. Low frequency signals routing. Should have copper fill (GND) plated up to 1 oz. |
| 2 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #1, 3 |
| 3 | Signal (high frequency) | 0.5 | High speed signal layer. High speed differential data busses from input connector to DMD |
| 4 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layers #3, #5 |
| 5 | Power | 0.5 | Primary split power planes for 1.8 V, 3.3 V, 10 V, -14 V, 18 V |
| 6 | Power | 0.5 | Primary split power planes for 1.8 V, 3.3 V, 10 V, -14 V, 18 V |
| 7 | Ground | 0.5 | Solid ground plane (net GND) reference for signal layer #8 |
| 8 | Signal (high frequency) | 0.5 | High speed signal layer. High speed differential data buses from input connector to DMD |
| 9 | Ground | 0.5 | Solid ground plane (net GND) Reference for signal layers #8, 10 |
| 10 | Side B—Secondary components, power mini-planes | 0.5 oz. (before plating) | Discrete components if necessary. Low frequency signals routing. Should be copper fill plated up to 1 oz. |