ZHCSLT4D April   2019  – December 2023 DLP660TE

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
    1. 4.1 Pin Functions—Test Pads
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Capacitance at Recommended Operating Conditions
    8. 5.8  Timing Requirements
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Optical Interface and System Image Quality
        1. 6.5.1.1 Numerical Aperture and Stray Light Control
        2. 6.5.1.2 Pupil Match
        3. 6.5.1.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 DMD Die Temperature Sensing
  9. Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Layers
      2. 9.2.2 Impedance Requirements
      3. 9.2.3 Trace Width, Spacing
        1. 9.2.3.1 Voltage Signals
  11. 10Device and Documentation Support
    1. 10.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 接收文档更新通知
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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订购信息

Micromirror Array Physical Characteristics

Table 5-2 Micromirror Array Physical Characteristics
PARAMETER DESCRIPTION VALUE UNIT
M Number of active columns (1) 2716 micromirrors
N Number of active rows (1) 1528 micromirrors
P Micromirror (pixel) pitch (1) 5.4 µm
Micromirror active array width (1) Micromirror pitch x number of active columns 14.67 mm
Micromirror active array height (1) Micromirror pitch x number of active rows 8.25 mm
Micromirror active border (Top / Bottom) (2) Pond of micromirror (POM) 56 micromirrors / side
Micromirror active border (Right / Left) (2) Pond of micromirror (POM) 20 micromirrors / side
See Figure 5-8.
The structure and qualities of the border around the active array includes a band of partially functional micromirrors called the “Pond Of Mirrors” (POM). These micromirrors are prevented from tilting toward the bright or “on” state but still require an electrical bias to tilt toward “off.”
GUID-F9795AC2-BB88-4723-BD8D-744857A37AA7-low.gif Figure 5-8 Micromirror Array Physical Characteristics

Refer to Section 5.10 for M, N, and P specifications.