The DMD features a built-in thermal diode that measures the temperature at one corner of the die outside the micromirror array. The DMD thermal diode pins E16 and E17 can be connected to the TMP411 temperature sensor as shown in Figure 8-2, and an external processor can interface with the TMP411 temperature sensor over I²C bus to allow monitoring of the DMD temperature. This temperature data can be leveraged to incorporate additional functionality in the overall system design such as adjusting illumination power, cooling fan speeds, TEC current inputs, and so forth, all with the idea of maintaining appropriate temperature control of the DMD.

A. Details omitted for clarity, see the DLPLCR67EVM evaluation module design for connections.

B. See the TMP411 datasheet for system board layout recommendation.

C. See the TMP411 datasheet and the DLPLCR67EVM design for suggested component values for R1, R2, R3, R4, and C1.

D. R5 = 0 Ω. R6 = 0 Ω. 0-Ω resistors need to be located close to the DMD package pins.

Figure 8-2 TMP411 Sample Schematic