ZHCSNS7C September 2021 – March 2024 DLP780TE
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 Storage Conditions
- 5.3 ESD Ratings
- 5.4 Recommended Operating Conditions
- 11
- 5.5 Thermal Information
- 5.6 Electrical Characteristics
- 5.7 Timing Requirements
- 15
- 5.8 System Mounting Interface Loads
- 17
- 5.9 Micromirror Array Physical Characteristics
- 19
- 5.10 Micromirror Array Optical Characteristics
- 21
- 5.11 Window Characteristics
- 5.12 Chipset Component Usage Specification
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3 Feature Description
- 6.4 Device Functional Modes
- 6.5 Optical Interface and System Image Quality Considerations
- 6.6 Micromirror Array Temperature Calculation
- 6.7 Micromirror Power Density Calculation
- 6.8 Window Aperture Illumination Overfill Calculation
- 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
8.3 Device Markings
The device marking includes both human-readable information and a 2-dimensional matrix code. The human-readable information is described in Figure 8-2. The 2-dimensional matrix code is an alpha-numeric string that contains the DMD part number, Part 1 and Part 2 of the serial number.
Example:
Figure 8-2 DMD Marking Locations