ZHCSNS7C September   2021  – March 2024 DLP780TE

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Timing Requirements
    9.     15
    10. 5.8  System Mounting Interface Loads
    11.     17
    12. 5.9  Micromirror Array Physical Characteristics
    13.     19
    14. 5.10 Micromirror Array Optical Characteristics
    15.     21
    16. 5.11 Window Characteristics
    17. 5.12 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Temperature Sensor Diode
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 DMD Power Supply Requirements
      2. 7.4.2 DMD Power Supply Power-Up Procedure
      3. 7.4.3 DMD Power Supply Power-Down Procedure
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
        1. 7.5.2.1 Layers
        2. 7.5.2.2 Impedance Requirements
        3. 7.5.2.3 Trace Width, Spacing
          1. 7.5.2.3.1 Voltage Signals
  9. 8 Device and Documentation Support
    1. 8.1 第三方米6体育平台手机版_好二三四免责声明
    2. 8.2 Device Support
      1. 8.2.1 Device Nomenclature
    3. 8.3 Device Markings
    4. 8.4 Documentation Support
      1. 8.4.1 Related Documentation
    5. 8.5 接收文档更新通知
    6. 8.6 支持资源
    7. 8.7 Trademarks
    8. 8.8 静电放电警告
    9. 8.9 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
MIN MAX UNIT
SUPPLY VOLTAGES
VDD Supply voltage for LVCMOS core logic(1) –0.5 2.3 V
VDDI Supply voltage for LVDS Interface(1) –0.5 2.3 V
VCC2 Micromirror Electrode and HVCMOS voltage(1)(2) –0.5 11 V
VMBRST Input voltage for MBRST pins(1) –17.5 22.5 V
|VDDI – VDD| Supply voltage delta (absolute value)(3) 0.3 V
INPUT VOLTAGES
|VID| Input differential voltage for LVDS pins (absolute value) 500 mV
V_LVCMOS Input voltage for all other input pins(1) –0.3 VDDI + 0.3 V
ENVIRONMENTAL
TARRAY Temperature, operating(4) 0 90 °C
Temperature, nonoperating(4) –40 90 °C
TDP Dew point temperature, operating and non–operating (noncondensing) 81 °C
(1) All voltages are referenced to common ground VSS. VDD, VDDI, and VCC2 power supplies are all required for all DMD operating modes.
(2) VCC2 supply transients must fall within specified voltages.
(3) Exceeding the recommended allowable voltage difference between VDD and VDDI may result in excessive current draw.
(4) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point 1 (TP1), shown in Figure 6-1 using the Micromirror Array Temperature Calculation.
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