The DMD features a built-in thermal diode that measures the temperature at one corner of the die outside the micromirror array. The thermal diode can be interfaced with the TMP411 temperature sensor as shown in Figure 7-4. The software application contains functions to configure the TMP411 to read the DLP781TE DMD temperature sensor diode. This data can be leveraged by the customer to incorporate additional functionality in the overall system design such as adjusting illumination, fan speeds, etc. All communication between the TMP411 and the DLPC4420 显示控制器 happens over the I²C interface. The TMP411 connects to the DMD through the pins outlined in Section 4.

Leave TEMP_N and TEMP_P pins unconnected (NC) if the temp sensor is not used.

A. Details are omitted for clarity.

B. See the TMP411 data sheet for system board layout recommendation.

C. See the TMP411 data sheet and the TI reference design for suggested component values for R1, R2, R3, R4, and C1.

D. R5 = 0Ω. R6 = 0Ω. Place 0Ω resistors close to the DMD package pins.

Figure 7-4 TMP411 Sample Schematic