ZHCSR38A November 2022 – September 2023 DLP801RE
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Storage Conditions
- 6.3 ESD Ratings
- 6.4 Recommended Operating Conditions
- 12
- 6.5 Thermal Information
- 6.6 Electrical Characteristics
- 6.7 Timing Requirements
- 16
- 6.8 System Mounting Interface Loads
- 18
- 6.9 Micromirror Array Physical Characteristics
- 20
- 6.10 Micromirror Array Optical Characteristics
- 22
- 6.11 Window Characteristics
- 6.12 Chipset Component Usage Specification
-
7 Detailed
Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 7.5 Optical Interface and System Image Quality Considerations
- 7.6 Micromirror Array Temperature Calculation
- 7.7 Micromirror Power Density Calculation
- 7.8 Window Aperture Illumination Overfill Calculation
- 7.9 Micromirror Landed-On/Landed-Off Duty Cycle
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
11.3 Device Markings
The device markings include both human-readable information and a two-dimensional matrix code. The human-readable information is described in . The two-dimensional matrix code is an alpha-numeric string that contains the DMD part number, Part 1 and Part 2 of the serial number.
Example:
Figure 11-2 DMD Marking Locations