ZHCSR39B October 2022 – September 2023 DLP801XE
PRODUCTION DATA
The layer stack-up and copper weight for each layer is shown in Table 10-1. Small sub-planes are allowed on signal routing layers to connect components to major sub-planes on top/bottom layers if necessary.
| LAYER NO. | LAYER NAME | COPPER WT. (oz.) | COMMENTS |
|---|---|---|---|
| 1 | Side A - DMD only | 1.5 | DMD, escapes, low frequency signals, power sub-planes. |
| 2 | Ground | 1 | Solid ground plane (net GND). |
| 3 | Signal | 0.5 | 50 Ω and 100 Ω differential signals |
| 4 | Ground | 1 | Solid ground plane (net GND) |
| 5 | VDD and VDDI | 1 | +1.8-V power plane |
| 6 | Signal | 0.5 | 50 Ω and 100 Ω differential signals |
| 7 | Ground | 1 | Solid ground plane (net GND). |
| 8 | Side B - All other Components | 1.5 | Discrete components, low frequency signals, power sub-planes |