DLPS036B September 2014 – October 2016 DLP9000
PRODUCTION DATA.
All external signals on the DMD are protected from damage by electrostatic discharge, and are tested in accordance with JESD22-A114-B electrostatic discharge (ESD) sensitivity testing human body model (HBM).
PACKAGE TERMINAL TYPE | VOLTAGE (MAXIMUM) | UNIT |
---|---|---|
Input | 2000 | V |
Output | 2000 | V |
VCC | 2000 | V |
VCCI | 2000 | V |
VOFFSET | 2000 | V |
VBIAS | 2000 | V |
VRESET | 2000 | V |
All MBRST | 2000 | V |
All CMOS devices require proper Electrostatic Discharge (ESD) handling procedures. Refer to drawing 2504641 DMD Handling Specification, for precautions to protect the DMD from ESD and to protect the DMD’s glass and electrical contacts. Refer to drawing 2504640 DMD Glass Cleaning Procedure, for correct and consistent methods for cleaning the glass of the DMD, in such a way that the anti-reflective coatings on the glass surface are not damaged.
Figure 21 provides a legend for reading the complete device name for any DLP device.
PACKAGE TYPE | ALTERNATE NAME |
---|---|
FLS | LCCC |
The device marking will include both human-readable information and a 2-dimensional matrix code. The human-readable information is described in Figure 22. The 2-dimensional matrix code is an alpha-numeric character string that contains the DMD part number, Part 1 of Serial Number, and Part 2 of Serial Number. The first character of the DMD Serial Number (part 1) is the manufacturing year. The second character of the DMD Serial Number (part 1) is the manufacturing month. The last character of the DMD Serial Number (part 2) is the bias voltage bin letter.
The following documents contain additional information related to the use of the DLP9000 family of devices:
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.