ZHCSCO5B June   2014  – February 2018 DLPA2000

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1. 3.1 简化电路原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Motor Driver Timing Requirements
    8. 6.8 Data Transmission Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  DMD Regulators
      2. 7.3.2  RGB Strobe Decoder
      3. 7.3.3  LED Current Control
      4. 7.3.4  Calculating Inductor Peak Current
      5. 7.3.5  LED Current Accuracy
      6. 7.3.6  Transient Current Limiting
      7. 7.3.7  1.1-V Regulator (Buck Converter)
      8. 7.3.8  Motor Driver
        1. 7.3.8.1 Motor Driver Overcurrent Protection
      9. 7.3.9  Measurement System
      10. 7.3.10 Protection Circuits
        1. 7.3.10.1 Thermal Warning (HOT) and Thermal Shutdown (TSD)
        2. 7.3.10.2 Low Battery Warning (BAT_LOW) and Undervoltage Lockout (UVLO)
        3. 7.3.10.3 DMD Regulator Fault (DMD_FLT)
        4. 7.3.10.4 V6V Power-Good (V6V_PGF) Fault
        5. 7.3.10.5 VLED Overvoltage (VLED_OVP) Fault
        6. 7.3.10.6 VLED Power Save Mode
        7. 7.3.10.7 V1V8 PG Failure
        8. 7.3.10.8 Interrupt Pin (INTZ)
        9. 7.3.10.9 SPI
      11. 7.3.11 Password Protected Registers
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. Table 7. Register Description
      2. 7.5.1     Chip Revision Register
        1. Table 8. Chip Revision Register Field Descriptions
      3. 7.5.2     Enable Register
        1. Table 9. Enable Register Field Descriptions
      4. 7.5.3     Transient-Current Limit Settings
        1. Table 10. Transient-Current Limit Settings Field Descriptions
      5. 7.5.4     Regulation Current MSB, SW4
        1. Table 11. Regulation Current MSB, SW4 Field Descriptions
      6. 7.5.5     Regulation Current LSB, SW4
        1. Table 12. Regulation Current LSB, SW4 Field Descriptions
        2. Table 13. Regulation Current LSB, SW4 Bit Definitions
      7. 7.5.6     Regulation Current MSB, SW5
        1. Table 14. Regulation Current MSB, SW5 Field Descriptions
      8. 7.5.7     Regulation Current LSB, SW5
        1. Table 15. Regulation Current LSB, SW5 Field Descriptions
        2. Table 16. Regulation Current LSB, SW5 Bit Definitions
      9. 7.5.8     Regulation Current MSB, SW6
        1. Table 17. Regulation Current MSB, SW6 Field Descriptions
      10. 7.5.9     Regulation Current LSB, SW6
        1. Table 18. Regulation Current LSB, SW6 Field Descriptions
        2. Table 19. Regulation Current LSB, SW6 Bit Definitions
      11. 7.5.10    Switch On/Off Control (Direct Mode)
        1. Table 20. Switch On/Off Control (Direct Mode) Field Descriptions
      12. 7.5.11    AFE (MUX) Control
        1. Table 21. AFE (MUX) Control Field Descriptions
      13. 7.5.12    Break Before Make (BBM) Timing
        1. Table 22. BBM Timing Field Descriptions
      14. 7.5.13    Interrupt Register
        1. Table 23. Interrupt Register Field Descriptions
      15. 7.5.14    Interrupt Mask Register
        1. Table 24. Interrupt Mask Register Field Descriptions
      16. 7.5.15    Timing Register VOFS, VBIAS, VRST, and RESETZ
        1. Table 25. Timing Register VOFS, VBIAS, VRST, and RESETZ Field Descriptions
        2. Table 26. Timing Register VOFS, VBIAS, VRST, and RESETZ Bit Definitions
      17. 7.5.16    Motor Control Register
        1. Table 27. Motor Control Register Field Descriptions
      18. 7.5.17    Password Register
        1. Table 28. Password Register Field Descriptions
      19. 7.5.18    System Configuration Register
        1. Table 29. System Configuration Register Field Descriptions
      20. 7.5.19    User EEPROM, BYTE0
        1. Table 30. User EEPROM, BYTE0 Field Descriptions
      21. 7.5.20    User EEPROM, BYTE1
        1. Table 31. User EEPROM, BYTE1 Field Descriptions
      22. 7.5.21    User EEPROM, BYTE2
        1. Table 32. User EEPROM, BYTE2 Field Descriptions
      23. 7.5.22    User EEPROM, BYTE3
        1. Table 33. User EEPROM, BYTE3 Field Descriptions
      24. 7.5.23    User EEPROM, BYTE4
        1. Table 34. User EEPROM, BYTE4 Field Descriptions
      25. 7.5.24    User EEPROM, BYTE5
        1. Table 35. User EEPROM, BYTE5 Field Descriptions
      26. 7.5.25    User EEPROM, BYTE6
        1. Table 36. User EEPROM, BYTE6 Field Descriptions
      27. 7.5.26    User EEPROM, BYTE7
        1. Table 37. User EEPROM, BYTE7 Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Projector Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Typical Mobile Sensing Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Dlpc150 System Interfaces
          1. 8.3.2.1.1 Control Interface
      3. 8.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC(1) DLPA2000 UNIT
YFF (DSBGA)
56 PINS
RθJA Junction-to-ambient thermal resistance(2) 45 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Estimated when mounted on high K JEDEC board per JESD 51-7 with thickness of 1.6 mm, 4 layers, size of 76.2 mm × 114.3 mm, and 2-oz. copper for top and bottom plane. Actual thermal impedance will depend on PCB used in the application.
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