ZHCSD09B September   2014  – October 2015 DLPA2005

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Transmission Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  DMD Regulators
      2. 7.3.2  RGB Strobe Decoder
      3. 7.3.3  LED Current Control
      4. 7.3.4  Maximum Led Currents and Efficiency Considerations
      5. 7.3.5  Calculating Inductor Peak Current
      6. 7.3.6  LED Current Accuracy
      7. 7.3.7  Transient Current Limiting
      8. 7.3.8  1.1-V Regulator (Buck Converter)
      9. 7.3.9  Measurement System
      10. 7.3.10 Protection Circuits
        1. 7.3.10.1 Thermal Warning (HOT) and Thermal Shutdown (TSD)
        2. 7.3.10.2 Low Battery Warning (BAT_LOW) and Undervoltage Lockout (UVLO)
        3. 7.3.10.3 DMD Regulator Fault (DMD_FLT)
        4. 7.3.10.4 V6V Power-Good (V6V_PGF) Fault
        5. 7.3.10.5 VLED Overvoltage (VLED_OVP) Fault
        6. 7.3.10.6 VLED Power Save Mode
        7. 7.3.10.7 V1V8 PG Failure
        8. 7.3.10.8 Interrupt Pin (INTZ)
        9. 7.3.10.9 SPI
      11. 7.3.11 Password Protected Registers
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Projector Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Typical Mobile Sensing Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Dlpc150 System Interfaces
          1. 8.3.2.1.1 Control Interface
      3. 8.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DLPA2005 updated_QFN package PAD2005 A4.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NUMBER
VINL 1 I Power supply input for VLED BUCK-BOOST power stage. Connect to system power.
2
SPI_DIN 3 I SPI data input
RESETZ 4 O Reset output to the DLP system (active low). Pin is held low to reset DLP system.
AGND1 5 GND Analog ground. Connect to ground plane.
INTZ 6 O Interrupt output signal (open drain). Connect to pullup resistor or short to ground.
SPI_CLK 7 I Clock input for SPI interface
SPI_CSZ 8 I SPI chip select (active low)
SPI_DOUT 9 O SPI data output
VINR 10 I Power supply input for DMD switch mode power supply (SMPS). Connect to system power.
SWN 11 I Connection for the DMD SMPS-inductor (high-side switch).
PGNDR 12 GND Power ground for DMD SMPS. Connect to ground plane.
SWP 13 O Connection for the DMD SMPS-inductor (low-side switch).
CNTR_VRST 14 O Connection to VRST for fast discharge function
VBIAS 15 O VBIAS output rail. Connect to ceramic capacitor.
No Connect 16 I Previously reference pin for the VRST regulator. On A4 design this reference is internal to DLPA2005 chip.
VOFS 17 O VOFS output rail. Connect to ceramic capacitor.
VINA 18 POWER Power supply input for sensitive analog circuitry
V2V5 19 O Internal supply filter pin for digital logic; typical 2.5 V
GND 20 GND Ground connection to be connected to ground plane.
LS_OUT 21 O Load switch
LS_IN 22 I Load switch
PGNDC 23 GND Power ground for VCORE BUCK
SWC 24 I/0 Connection for 1.1-V BUCK inductor
VINC 25 I Power supply input for VCORE BUCK power stage. Connect to system power.
PWM_IN 26 I Reference voltage input for analog comparator.
PROJ_ON 27 I Input signal to enable or disable the IC and DLP projector.
CMP_OUT 28 O Analog-comparator output.
VCORE 29 I VCORE BUCK converter feedback pin.
SENS2 30 I Input signal from temperature sensor.
LED_SEL0 31 I Digital input to the RGB Strobe Decoder
VSPI 32 I Power supply input for SPI interface. Connect to system I/O voltage.
SENS1 33 I Input signal from light sensor.
LED_SEL1 34 I Digital input to the RGB Strobe Decoder
V6V 35 O Internal supply filter pin for gate driver circuitry. Typical 6.25 V
RLIM_K 36 I Kelvin sense connection to top side of LED current sense resistor.
For best accuracy, route this trace directly to the top of the current sense resistor and separate it from the normal trace from the current sense resistor to the RLIM pins.
SW6 37 O Low-side MOSFET switch for LED cathode. Connect to RGB LED assembly.
SW5 38 O Low-side MOSFET switch for LED cathode. Connect to RGB LED assembly.
SW4 39 O Low-side MOSFET switch for LED cathode. Connect to RGB LED assembly.
RLIM 40 O Connection to LED ‘current sense’ resistor.
Bottom side of sense resistor is connected to GND.
VLED 41 / 42 O VLED BUCK-BOOST converter output pin.
L2 43 / 44 I Connection for VLED BUCK-BOOST inductor.
PGNDL 45 / 46 GND Power ground for VLED BUCK-BOOST. Connect to ground plane.
L1 47 / 48 O Connection for VLED BUCK-BOOST inductor.
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