ZHCSE87A October   2015  – September 2023 DLPA3000

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. 说明(续)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Parameters
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 功能方框图
    3. 8.3 Feature Description
      1. 8.3.1 Supply and Monitoring
        1. 8.3.1.1 Supply
        2. 8.3.1.2 Monitoring
          1. 8.3.1.2.1 Block Faults
          2. 8.3.1.2.2 Low Battery and UVLO
          3. 8.3.1.2.3 Auto LED Turn Off Functionality
          4. 8.3.1.2.4 Thermal Protection
      2. 8.3.2 Illumination
        1. 8.3.2.1 Programmable Gain Block
        2. 8.3.2.2 LDO Illum
        3. 8.3.2.3 Illumination Driver A
        4. 8.3.2.4 RGB Strobe Decoder
          1. 8.3.2.4.1 Break Before Make (BBM)
          2. 8.3.2.4.2 Openloop Voltage
          3. 8.3.2.4.3 Transient Current Limit
        5. 8.3.2.5 Illumination Monitoring
          1. 8.3.2.5.1 Power Good
          2. 8.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 8.3.2.6 Load Current and Supply Voltage
        7. 8.3.2.7 Illumination Driver Plus Power FETS Efficiency
      3. 8.3.3 DMD Supplies
        1. 8.3.3.1 LDO DMD
        2. 8.3.3.2 DMD HV Regulator
          1. 8.3.3.2.1 Power-Up and Power-Down Timing
        3. 8.3.3.3 DMD/DLPC Buck Converters
        4. 8.3.3.4 DMD Monitoring
          1. 8.3.3.4.1 Power Good
          2. 8.3.3.4.2 Overvoltage Fault
      4. 8.3.4 Buck Converters
        1. 8.3.4.1 LDO Bucks
        2. 8.3.4.2 General Purpose Buck Converters
        3. 8.3.4.3 Buck Converter Monitoring
          1. 8.3.4.3.1 Power Good
          2. 8.3.4.3.2 Overvoltage Fault
        4. 8.3.4.4 Buck Converter Efficiency
      5. 8.3.5 Auxiliary LDOs
      6. 8.3.6 Measurement System
      7. 8.3.7 Digital Control
        1. 8.3.7.1 SPI
        2. 8.3.7.2 Interrupt
        3. 8.3.7.3 Fast-Shutdown in Case of Fault
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application Setup Using DLPA3000
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Typical Application with DLPA3000 Internal Block Diagram
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 SPI Connections
    4. 11.4 RLIM Routing
    5. 11.5 LED Connection
    6. 11.6 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 Device Support
      1. 12.2.1 Device Nomenclature
    3. 12.3 Related Links
    4. 12.4 接收文档更新通知
    5. 12.5 支持资源
    6. 12.6 Trademarks
    7. 12.7 支持资源
    8. 12.8 静电放电警告
    9. 12.9 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
Thermal Protection

The chip temperature is constantly monitored to prevent overheating of the device. There are two levels of a fault condition. The first is TS_WARN (0x0C, bit 0) to warn for overheating. This is an indication that the chip temperature raises to a critical temperature. The next level of warning is TS_SHUT(0x0C, bit 1). This occurs at a higher temperature than TS_WARN (0x0C, bit 0) and shuts down the chip to prevent permanent damage. Both temperature faults have hysteresis on their levels to prevent rapid switching around the temperature threshold.