ZHCSIA7 May   2018 DLPA4000

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      系统方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Description
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Low Battery and UVLO
          3. 7.3.1.2.3 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illumination
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 External MOSFETs
          1. 7.3.2.4.1 Gate series resistor (RG)
          2. 7.3.2.4.2 Gate series diode (DG)
          3. 7.3.2.4.3 Gate parallel capacitance (CG)
        5. 7.3.2.5 RGB Strobe Decoder
          1. 7.3.2.5.1 Break Before Make (BBM)
          2. 7.3.2.5.2 Openloop Voltage
          3. 7.3.2.5.3 Transient Current Limit
        6. 7.3.2.6 Illumination Monitoring
          1. 7.3.2.6.1 Power Good
          2. 7.3.2.6.2 RatioMetric Overvoltage Protection
      3. 7.3.3 External Power MOSFET Selection
        1. 7.3.3.1 Threshold Voltage
        2. 7.3.3.2 Gate Charge and Gate Timing
        3. 7.3.3.3 On-resistance RDS(on)
      4. 7.3.4 DMD Supplies
        1. 7.3.4.1 LDO DMD
        2. 7.3.4.2 DMD HV Regulator
        3. 7.3.4.3 DMD/DLPC Buck Converters
        4. 7.3.4.4 DMD Monitoring
          1. 7.3.4.4.1 Power Good
          2. 7.3.4.4.2 Overvoltage Fault
      5. 7.3.5 Buck Converters
        1. 7.3.5.1 LDO Bucks
        2. 7.3.5.2 General Purpose Buck Converters
        3. 7.3.5.3 Buck Converter Monitoring
          1. 7.3.5.3.1 Power Good
          2. 7.3.5.3.2 Overvoltage Fault
      6. 7.3.6 Auxiliary LDOs
      7. 7.3.7 Measurement System
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 SPI
      2. 7.5.2 Interrupt
      3. 7.5.3 Fast-Shutdown in Case of Fault
      4. 7.5.4 Protected Registers
      5. 7.5.5 Writing to EEPROM
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection for General-Purpose Buck Converters
    3. 8.3 System Example With DLPA4000 Internal Block Diagram
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up and Power-Down Timing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 LED Driver
        1. 10.1.1.1 PowerBlock Gate Control Isolation
        2. 10.1.1.2 VIN to PowerBlocks
        3. 10.1.1.3 Return Current from LEDs and RSense
        4. 10.1.1.4 RC Snubber
        5. 10.1.1.5 Capacitor Choice
      2. 10.1.2 General Purpose Buck 2
      3. 10.1.3 SPI Connections
      4. 10.1.4 RLIM Routing
      5. 10.1.5 LED Connection
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1.3 Return Current from LEDs and RSense

The RSENSE resistor (R72) senses the LED current. Connect the RLIM_K_1 and RLIM_K_2 lines close to the top side of the measurement resistor to accurately measure the LED current. Connect the RLIM_BOT_K_1 and RLIM_BOT_K_2 lines close to the bottom side of the measurement resistor to accurately measure the LED current.

The switched LED current flows through the RLIM resistor and the RSENSE resistor. Design a low-ohmic ground connection from the RSENSE resistor that retuns to the input voltage connector. Make sure the PGND return has a dedicated plane on the top layer that returns to the connector. However, the PGND top layer must have vias placed from inside the top layer to the internal PGND plane. Make sure the PGND vias underneath the power block are compliant with the power block layout thermal guidelines. See CSD87350Q5D data sheet for guidelines..

Make sure the designer considers the entire return path for current from the LED connector through the RLIM resistor plane and the RSENSE resistor (R72) during layout. Any obstacles between the LED connectors and the PGND on the input power connector can cause power reduction. Similar obstacles can cause possible image artifacts due to slow LED turn-on times. See the reference design for a suggested placement and plane sizes.

DLPA4000 DLPA4000_Current_Return_Path.gifFigure 28. Current Return Path
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