米6体育平台手机版

ZHCSDJ3C March 2015 – June 2019 DLPC150

PRODUCTION DATA.

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机械数据 (封装 | 引脚)

ZEZ|201
- MPBGAK7

散热焊盘机械数据 (封装 | 引脚)

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

			MIN	NOM	MAX	UNIT
V_(VDD)	Core power 1.1 V (main 1.1 V)	±5% tolerance	1.045	1.1	1.155	V
V_(VDDLP12)	Core power 1.1 V	±5% tolerance See ⁽¹⁾	1.02	1.1	1.18	V
V_(VDDLP12)	Core power 1.1 V	±5% tolerance See ⁽¹⁾	1.12	1.2	1.28	V
V_(VCC18)	All 1.8-V I/O power: (1.8-V power supply for all I/O other than the host or parallel interface and the SPI flash interface. This includes RESETZ, PARKZ, LED_SEL, CMP, GPIO, TSTPT, and Reserved pins.)	±8.5% tolerance	1.64	1.8	1.96	V
V_{(VCC_INTF)}	Host or parallel interface I/O power: 1.8 to 3.3 V (includes IIC0, PDATA, video syncs, and HOST_IRQ pins)	±8.5% tolerance See ⁽¹⁾	1.64	1.8	1.96	V
			2.28	2.5	2.72
			3.02	3.3	3.58
V_{(VCC_FLSH)}	Flash interface I/O power:1.8 to 3.3 V	±8.5% tolerance See ⁽¹⁾	1.64	1.8	1.96	V
			2.28	2.5	2.72
			3.02	3.3	3.58
V_{(VDD_PLLM)}	MCG PLL 1.1-V power	±9.1% tolerance See ⁽²⁾	1.025	1.1	1.155	V
V_{(VDD_PLLD)}	DCG PLL 1.1-V power	±9.1% tolerance See ⁽²⁾	1.025	1.1	1.155	V
T_A	Operating ambient temperature range⁽³⁾		–30		85	°C

(1) These supplies have multiple valid ranges.

(2) These I/O supply ranges are wider to facilitate additional filtering.

(3) The operating ambient temperature range assumes 0 forced air flow, a JEDEC JESD51 junction-to-ambient thermal resistance value at 0 forced air flow (R_θJA at 0 m/s), a JEDEC JESD51 standard test card and environment, along with min and max estimated power dissipation across process, voltage, and temperature. Thermal conditions vary by application, which will impact R_θJA. Thus, maximum operating ambient temperature varies by application.

T_{a_min} = T_{j_min} – (P_{d_min} × R_θJA) = –30°C – (0.0W × 30.3°C/W) = –30°C
T_{a_max} = T_{j_max} – (P_{d_max} × R_θJA) = +105°C – (0.348W × 30.3°C/W) = +94.4°C