ZHCSIF8I December   2015  – August 2024 DLPC230-Q1 , DLPC231-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics for Fixed Voltage I/O
    7. 5.7  DMD High-Speed SubLVDS Electrical Characteristics
    8. 5.8  DMD Low-Speed SubLVDS Electrical Characteristics
    9. 5.9  OpenLDI LVDS Electrical Characteristics
    10. 5.10 Power Dissipation Characterisics
    11. 5.11 System Oscillators Timing Requirements
    12. 5.12 Power Supply and Reset Timing Requirements
    13. 5.13 Parallel Interface General Timing Requirements
    14. 5.14 OpenLDI Interface General Timing Requirements
    15. 5.15 Parallel/OpenLDI Interface Frame Timing Requirements
    16. 5.16 Host/Diagnostic Port SPI Interface Timing Requirements
    17. 5.17 Host/Diagnostic Port I2C Interface Timing Requirements
    18. 5.18 Flash Interface Timing Requirements
    19. 5.19 TPS99000-Q1 SPI Interface Timing Requirements
    20. 5.20 TPS99000-Q1 AD3 Interface Timing Requirements
    21. 5.21 DLPC23x-Q1 I2C Port Interface Timing Requirements
    22. 5.22 Chipset Component Usage Specification
  7. 6 Parameter Measurement Information
    1. 6.1 HOST_IRQ Usage Model
    2. 6.2 Input Source
      1. 6.2.1 Supported Input Sources
      2. 6.2.2 Parallel Interface Supported Data Transfer Formats
        1. 6.2.2.1 OpenLDI Interface Supported Data Transfer Formats
          1. 6.2.2.1.1 OpenLDI Interface Bit Mapping Modes
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Parallel Interface
      2. 7.3.2  OpenLDI Interface
      3. 7.3.3  DMD (SubLVDS) Interface
      4. 7.3.4  Serial Flash Interface
      5. 7.3.5  Serial Flash Programming
      6. 7.3.6  Host Command and Diagnostic Processor Interfaces
      7. 7.3.7  GPIO Supported Functionality
      8. 7.3.8  Built-In Self Test (BIST)
      9. 7.3.9  EEPROMs
      10. 7.3.10 Temperature Sensor
      11. 7.3.11 Debug Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Display Mode
      3. 7.4.3 Calibration Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Head-Up Display
        1. 8.2.1.1 Design Requirements
      2. 8.2.2 Headlight
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Headlight Video Input
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Management
      2. 8.3.2 Hot Plug Usage
      3. 8.3.3 Power Supply Filtering
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1  PCB Layout Guidelines for Internal ASIC PLL Power
        2. 8.4.1.2  DLPC23x-Q1 Reference Clock
          1. 8.4.1.2.1 Recommended Crystal Oscillator Configuration
        3. 8.4.1.3  DMD Interface Layout Considerations
        4. 8.4.1.4  General PCB Recommendations
        5. 8.4.1.5  General Handling Guidelines for Unused CMOS-Type Pins
        6. 8.4.1.6  Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
        7. 8.4.1.7  Number of Layer Changes
        8. 8.4.1.8  Stubs
        9. 8.4.1.9  Terminations
        10. 8.4.1.10 Routing Vias
        11. 8.4.1.11 Layout Examples
      2. 8.4.2 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 9.1.2 Device Nomenclature
        1. 9.1.2.1 Device Markings DLPC230-Q1 or DLPC230S-Q1
        2. 9.1.2.2 Device Markings DLPC231-Q1 or DLPC231S-Q1
        3. 9.1.2.3 Video Timing Parameter Definitions
    2. 9.2 Trademarks
    3. 9.3 静电放电警告
    4. 9.4 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX(2) UNIT
TOTAL
I(VCC11) 1.1V total current 201 467.1 mA
I(VCC18) 1.8V total current 71 151.6 mA
I(VCC33) 3.3V total current 28.1 30.1 mA
ESTIMATED CURRENT PER SUPPLY(3)
I(VCCK) 1.1V Core current 131.5 390.7 mA
I(VCC11A_DDI_0) 1.1V Core current (Filtered) At 600MHz data rate 15.8 17.4 mA
I(VCC11A_DDI_1) 1.1V Core current (Filtered) At 600MHz data rate 15.8 17.4 mA
I(VCC11A_LVDS) 1.1V Core current (Filtered) OpenLDI Interface, single port, 5 lanes active 22.5 24.8 mA
I(VCC11AD_PLLM) 1.1V Core current (MCG PLL) 7.7 8.4 mA
I(VCC11AD_PLLD) 1.1V Core current (DCG PLL) 7.7 8.4 mA
I(VCC18A_LVDS) 1.8V I/O current (Both 8-bit ports - DMD HS differential Interface) At 600MHz data rate 63.3 131.5 mA
I(VCC18A_LVDS) 1.8V I/O current (DMD LS differential Interface) At 120MHz data rate 5.2 10.7 mA
I(VCC18IO) 1.8V I/O current (DMD LS single-ended interfaces, DMD reset) 2.5 9.4 mA
I(VCC3IO_MVGP) 3.3V I/O current (TPS99000-Q1 SPI, TPS99000-Q1 Reset, PMIC_PARKZ, RESETZ) 1.7 1.8 mA
I(VCC3IO_INTF) 3.3V I/O current (Host SPI, Host I2C, Host IRQ, JTAG, Parallel Port) 1.7 1.8 mA
I(VCC3IO_FLSH) 3.3V I/O current (Serial Flash SPI interface) 5.5 5.9 mA
I(VCC3IO_OSC) 3.3V I/O current (Crystal/Oscillator) With 3kΩ external series resistor (RS) 0.975 1.3 mA
I(VCC3IO) 3.3V I/O current (GPIO, PMIC_AD3, Mstr I2C, TSTPT, ETM, and so forth) 12.6 13.5 mA
I(VCC33A_LVDS) 3.3V I/O current (OpenLDI Interface - each port - 5 lanes active) 6.3 6.8 mA
(1) Typical-case power measured with PVT condition = nominal process, typical voltage, typical temperature (25°C case temperature). Input source 1152 × 576 24-bit 60Hz OpenLDI with RGBW ramp image.
(2) Worst-case power PVT condition = corner process, high voltage, high temperature (105°C case temperature). Input source 1358 × 566 24-bit.
60Hz OpenLDI with pseudo-random noise image.
(3) Estimated current per supply was not directly measured. These values are based on an approximate expected current consumption percentage of the total measured current drawn by each voltage rail.
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