ZHCSIF8I
December 2015 – August 2024
DLPC230-Q1
,
DLPC231-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Electrical Characteristics for Fixed Voltage I/O
5.7
DMD High-Speed SubLVDS Electrical Characteristics
5.8
DMD Low-Speed SubLVDS Electrical Characteristics
5.9
OpenLDI LVDS Electrical Characteristics
5.10
Power Dissipation Characterisics
5.11
System Oscillators Timing Requirements
5.12
Power Supply and Reset Timing Requirements
5.13
Parallel Interface General Timing Requirements
5.14
OpenLDI Interface General Timing Requirements
5.15
Parallel/OpenLDI Interface Frame Timing Requirements
5.16
Host/Diagnostic Port SPI Interface Timing Requirements
5.17
Host/Diagnostic Port I2C Interface Timing Requirements
5.18
Flash Interface Timing Requirements
5.19
TPS99000-Q1 SPI Interface Timing Requirements
5.20
TPS99000-Q1 AD3 Interface Timing Requirements
5.21
DLPC23x-Q1 I2C Port Interface Timing Requirements
5.22
Chipset Component Usage Specification
6
Parameter Measurement Information
6.1
HOST_IRQ Usage Model
6.2
Input Source
6.2.1
Supported Input Sources
6.2.2
Parallel Interface Supported Data Transfer Formats
6.2.2.1
OpenLDI Interface Supported Data Transfer Formats
6.2.2.1.1
OpenLDI Interface Bit Mapping Modes
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Parallel Interface
7.3.2
OpenLDI Interface
7.3.3
DMD (SubLVDS) Interface
7.3.4
Serial Flash Interface
7.3.5
Serial Flash Programming
7.3.6
Host Command and Diagnostic Processor Interfaces
7.3.7
GPIO Supported Functionality
7.3.8
Built-In Self Test (BIST)
7.3.9
EEPROMs
7.3.10
Temperature Sensor
7.3.11
Debug Support
7.4
Device Functional Modes
7.4.1
Standby Mode
7.4.2
Display Mode
7.4.3
Calibration Mode
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Head-Up Display
8.2.1.1
Design Requirements
8.2.2
Headlight
8.2.2.1
Design Requirements
8.2.2.2
Headlight Video Input
8.3
Power Supply Recommendations
8.3.1
Power Supply Management
8.3.2
Hot Plug Usage
8.3.3
Power Supply Filtering
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
PCB Layout Guidelines for Internal ASIC PLL Power
8.4.1.2
DLPC23x-Q1 Reference Clock
8.4.1.2.1
Recommended Crystal Oscillator Configuration
8.4.1.3
DMD Interface Layout Considerations
8.4.1.4
General PCB Recommendations
8.4.1.5
General Handling Guidelines for Unused CMOS-Type Pins
8.4.1.6
Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
8.4.1.7
Number of Layer Changes
8.4.1.8
Stubs
8.4.1.9
Terminations
8.4.1.10
Routing Vias
8.4.1.11
Layout Examples
8.4.2
Thermal Considerations
9
Device and Documentation Support
9.1
Device Support
9.1.1
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9.1.2
Device Nomenclature
9.1.2.1
Device Markings DLPC230-Q1 or DLPC230S-Q1
9.1.2.2
Device Markings DLPC231-Q1 or DLPC231S-Q1
9.1.2.3
Video Timing Parameter Definitions
9.2
Trademarks
9.3
静电放电警告
9.4
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
ZDQ|324
MPBG775B
散热焊盘机械数据 (封装 | 引脚)
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zhcsif8i_oa
zhcsif8i_pm
8.4.1.10
Routing Vias
The number of vias on each DMD_HS and DMD_LS signal must be minimized and must not exceed two. If two are required, one must be placed at each end of the line (one at the ASIC and one at the DMD).
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