ZHCSLG8E August   2020  – August 2024 DLPC230S-Q1 , DLPC231S-Q1

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Thermal Information
   5. 5.5  Electrical Characteristics
   6. 5.6  Electrical Characteristics for Fixed Voltage I/O
   7. 5.7  DMD High-Speed SubLVDS Electrical Characteristics
   8. 5.8  DMD Low-Speed SubLVDS Electrical Characteristics
   9. 5.9  OpenLDI LVDS Electrical Characteristics
   10. 5.10 Power Dissipation Characterisics
   11. 5.11 System Oscillators Timing Requirements
   12. 5.12 Power Supply and Reset Timing Requirements
   13. 5.13 Parallel Interface General Timing Requirements
   14. 5.14 OpenLDI Interface General Timing Requirements
   15. 5.15 Parallel/OpenLDI Interface Frame Timing Requirements
   16. 5.16 Host/Diagnostic Port SPI Interface Timing Requirements
   17. 5.17 Host/Diagnostic Port I2C Interface Timing Requirements
   18. 5.18 Flash Interface Timing Requirements
   19. 5.19 TPS99000S-Q1 SPI Interface Timing Requirements
   20. 5.20 TPS99000S-Q1 AD3 Interface Timing Requirements
   21. 5.21 DLPC23xS-Q1 I2C Port Interface Timing Requirements
   22. 5.22 Chipset Component Usage Specification
7. 6 Parameter Measurement Information
   1. 6.1 HOST_IRQ Usage Model
   2. 6.2 Input Source
      1. 6.2.1 Supported Input Sources
      2. 6.2.2 Parallel Interface Supported Data Transfer Formats
         1. 6.2.2.1 OpenLDI Interface Supported Data Transfer Formats
            1. 6.2.2.1.1 OpenLDI Interface Bit Mapping Modes
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1  Parallel Interface
      2. 7.3.2  OpenLDI Interface
      3. 7.3.3  DMD (SubLVDS) Interface
      4. 7.3.4  Serial Flash Interface
      5. 7.3.5  Serial Flash Programming
      6. 7.3.6  Host Command and Diagnostic Processor Interfaces
      7. 7.3.7  GPIO Supported Functionality
      8. 7.3.8  Built-In Self Test (BIST)
      9. 7.3.9  EEPROMs
      10. 7.3.10 Temperature Sensor
      11. 7.3.11 Debug Support
   4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Display Mode
      3. 7.4.3 Calibration Mode
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Head-Up Display
         1. 8.2.1.1 Design Requirements
   3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Management
      2. 8.3.2 Hot Plug Usage
      3. 8.3.3 Power Supply Filtering
   4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
         1. 8.4.1.1  PCB Layout Guidelines for Internal ASIC PLL Power
         2. 8.4.1.2  DLPC23xS-Q1 Reference Clock
            1. 8.4.1.2.1 Recommended Crystal Oscillator Configuration
         3. 8.4.1.3  DMD Interface Layout Considerations
         4. 8.4.1.4  General PCB Recommendations
         5. 8.4.1.5  General Handling Guidelines for Unused CMOS-Type Pins
         6. 8.4.1.6  Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
         7. 8.4.1.7  Number of Layer Changes
         8. 8.4.1.8  Stubs
         9. 8.4.1.9  Terminations
         10. 8.4.1.10 Routing Vias
      2. 8.4.2 Thermal Considerations
10. 9 Device and Documentation Support
    1. 9.1 Device Support
       1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
       2. 9.1.2 Device Nomenclature
          1. 9.1.2.1 Device Markings DLPC230-Q1 or DLPC230S-Q1
          2. 9.1.2.2 Device Markings DLPC231-Q1 or DLPC231S-Q1
          3. 9.1.2.3 Video Timing Parameter Definitions
    2. 9.2 Trademarks
    3. 9.3 静电放电警告
    4. 9.4 术语表
11. 10Revision History
12. 11Mechanical, Packaging, and Orderable Information