ZHCS244C January   2012  – August 2015 DLPC300

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  I/O Electrical Characteristics
    6. 6.6  Crystal Port Electrical Characteristics
    7. 6.7  Power Consumption
    8. 6.8  I2C Interface Timing Requirements
    9. 6.9  Parallel Interface Frame Timing Requirements
    10. 6.10 Parallel Interface General Timing Requirements
    11. 6.11 Parallel I/F Maximum Supported Horizontal Line Rate
    12. 6.12 BT.565 I/F General Timing Requirements
    13. 6.13 Flash Interface Timing Requirements
    14. 6.14 DMD Interface Timing Requirements
    15. 6.15 Mobile Dual Data Rate (mDDR) Memory Interface Timing Requirements
    16. 6.16 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Control
      2. 7.4.2 Parallel Bus Interface
      3. 7.4.3 BT.656 Interface
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 System Input Interfaces
          1. 8.2.2.1.1 Control Interface
        2. 8.2.2.2 Input Data Interface
        3. 8.2.2.3 System Output Interfaces
          1. 8.2.2.3.1 Illumination Interface
        4. 8.2.2.4 System Support Interfaces
          1. 8.2.2.4.1 Mobile DDR Synchronous Dram (MDDR)
          2. 8.2.2.4.2 Flash Memory Interface
          3. 8.2.2.4.3 DLPC300 Reference Clock
        5. 8.2.2.5 DMD Interfaces
          1. 8.2.2.5.1 DLPC300 to DLP3000 Digital Data
          2. 8.2.2.5.2 DLPC300 to DLP3000 Control Interface
          3. 8.2.2.5.3 DLPC300 to DLP3000 Micromirror Reset Control Interface
        6. 8.2.2.6 Maximum Signal Transition Time
    3. 8.3 System Examples
      1. 8.3.1 Video Source System Application
      2. 8.3.2 High Pattern Rate System With Optional Fpga
  9. 9 Power Supply Recommendations
    1. 9.1 System Power-Up and Power-Down Sequence
      1. 9.1.1 Power Up Sequence
      2. 9.1.2 Power Down Sequence
      3. 9.1.3 Additional Power-Up Initialization Sequence Details
    2. 9.2 System Power I/O State Considerations
    3. 9.3 Power-Good (PARK) Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed Circuit Board Design Guidelines
      2. 10.1.2 Printed Circuit Board Layer Stackup Geometry
      3. 10.1.3 Signal Layers
      4. 10.1.4 Routing Constraints
      5. 10.1.5 Termination Requirements
      6. 10.1.6 PLL
      7. 10.1.7 General Handling Guidelines for Unused CMOS-Type Pins
      8. 10.1.8 Hot-Plug Usage
      9. 10.1.9 External Clock Input Crystal Oscillator
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 器件命名规则
      3. 11.1.3 器件标记
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZVB|176
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 器件命名规则

Figure 24 提供了读取任一 DLP 器件完整器件名称的图例。

DLPC300 Device_Nomenclature_LPS023.gif Figure 24. 器件命名规则

11.1.3 器件标记

器件标记由 Figure 25 中显示的字段组成。

DLPC300 Device_Symbolization_LPS023.gif Figure 25. 器件标记

11.2 文档支持

11.2.1 相关文档

11.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 商标

E2E is a trademark of Texas Instruments.

《DLP is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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