ZHCSIG4B July   2018  – October 2020 DLPC3434

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Test Pins and General Control
    2. 5.2 Parallel Port Input
    3. 5.3 DSI Input Data and Clock
    4. 5.4 DMD Reset and Bias Control
    5. 5.5 DMD Sub-LVDS Interface
    6. 5.6 Peripheral Interface
    7. 5.7 GPIO Peripheral Interface
    8. 5.8 Clock and PLL Support
    9. 5.9 Power and Ground
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
    15. 6.15 Other Timing Requirements
    16. 6.16 DMD Sub-LVDS Interface Switching Characteristics
    17. 6.17 DMD Parking Switching Characteristics
    18. 6.18 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 Parallel Interface Data Transfer Format
        3. 7.3.1.3 3D Display
      2. 7.3.2 Device Startup
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PLL Power Layout
      2. 10.1.2 Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3 Unused Pins
      4. 10.1.4 DMD Control and Sub-LVDS Signals
      5. 10.1.5 Layer Changes
      6. 10.1.6 Stubs
      7. 10.1.7 Terminations
      8. 10.1.8 Routing Vias
      9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

6.9 DMD Low-Speed Interface Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER(1)TEST CONDITIONSMINTYPMAXUNIT
VOH(DC)DC output high voltage for DMD_LS_WDATA and DMD_LS_CLK0.7 × VCC18V
VOL(DC)DC output low voltage for DMD_LS_WDATA and DMD_LS_CLK0.3 × VCC18V
VOH(AC)(2)AC output high voltage for DMD_LS_WDATA and DMD_LS_CLK0.8 × VCC18VCC18 + 0.5V
VOL(AC)(3)AC output low voltage for DMD_LS_WDATA and DMD_LS_CLK–0.50.2 × VCC18V
Slew rateDMD_LS_WDATA and DMD_LS_CLKVOL(DC) to VOH(AC) for rising edge and VOH(DC) to VOL(AC) for rising edge1.03.0V/ns
DMD_DEN_ARSTZVOL(AC) to VOH(AC) for rising edge0.25
DMD_LS_RDATA0.5
(1) See Figure 6-3 for DMD_LS_CLK, and DMD_LS_WDATA rise and fall times. See Figure 6-4 for DMD_DEN_ARSTZ rise and fall times.
(2) VOH(AC) maximum applies to overshoot. When the DMD_LS_WDATA and DMD_LS_CLK lines include a proper 43-Ω series termination resistor, the DMD operates within the LPSDR input AC specifications.
(3) VOL(AC) minimum applies to undershoot. When the DMD_LS_WDATA and DMD_LS_CLK lines include a proper 43-Ω series termination resistor, the DMD operates within the LPSDR input AC specifications.
GUID-CB84375F-1D97-4F54-9387-009F07F888E0-low.gifFigure 6-3 LS_CLK and LS_WDATA Slew Rate
GUID-0B5BD179-CD36-4ED1-977C-27FB5BCB06C7-low.gifFigure 6-4 DMD_DEN_ARSTZ Slew Rate
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