| THERMAL METRIC(1) |
DLPC3437 |
UNIT |
| ZEZ
(NFBGA) |
| 201
PINS |
| RθJC |
Junction-to-case top thermal resistance |
10.1 |
°C/W |
| RθJA |
Junction-to-air thermal resistance |
at 0 m/s of forced airflow(2) |
28.8 |
°C/W |
| at 1 m/s of forced airflow(2) |
25.3 |
| at 2 m/s of forced airflow(2) |
24.4 |
| ψJT |
Temperature variance from junction to package top
center temperature, per unit power dissipation(3) |
0.23 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
IC
Package Thermal Metrics application report,
SPRA953.
(2) Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal
resistance of the package as measured using a JEDEC defined standard test PCB.
This JEDEC test PCB is not necessarily representative of the DLPC34xx PCB and
thus the reported thermal resistance may not be accurate in the actual product
application. Although the actual thermal resistance may be different, it is the
best information available during the design phase to estimate thermal
performance.
(3) Example: (0.5 W) × (0.2 °C/W) ≈ 0.1°C temperature rise.