ZHCSHH9D January   2017  – August 2021 DLPC3437

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillators Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
    15. 6.15 Other Timing Requirements
    16. 6.16 DMD Sub-LVDS Interface Switching Characteristics
    17. 6.17 DMD Parking Switching Characteristics
    18. 6.18 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 Parallel Interface Data Transfer Format
      2. 7.3.2 Device Start-Up
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast PARK Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PLL Power Layout
      2. 10.1.2 Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3 Unused Pins
      4. 10.1.4 DMD Control and Sub-LVDS Signals
      5. 10.1.5 Layer Changes
      6. 10.1.6 Stubs
      7. 10.1.7 Terminations
      8. 10.1.8 Routing Vias
      9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

Power-Up Initialization Sequence

An external power monitor is required to hold the DLPC34xx controller in system reset during the power-up sequence by driving RESETZ to a logic-low state. It shall continue to drive RESETZ low until all controller voltages reach the minimum specified voltage levels, PARKZ goes high, and the input clocks are stable. The external power monitoring is automatically done by the DLPAxxxx PMIC.

No signals output by the DLPC34xx controller will be in their active state while RESETZ is asserted. The following signals are tri-stated while RESETZ is asserted:

  • SPI0_CLK
  • SPI0_DOUT
  • SPI0_CSZ0
  • SPI0_CSZ1
  • GPIO [19:00]

Add external pullup (or pulldown) resistors to all tri-stated output signals (including bidirectional signals to be configured as outputs) to avoid floating controller outputs during reset if they are connected to devices on the PCB that can malfunction. For SPI, at a minimum, include a pullup to any chip selects connected to devices. Unused bidirectional signals can be configured as outputs in order to avoid floating controller inputs after RESETZ is set high.

The following signals are forced to a logic low state while RESETZ is asserted and the corresponding I/O power is applied:

  • LED_SEL_0
  • LED_SEL_1
  • DMD_DEN_ARSTZ

After power is stable and the PLL_REFCLK_I clock input to the DLPC34xx controller is stable, then RESETZ should be deactivated (set to a logic high). The DLPC34xx controller then performs a power-up initialization routine that first locks its PLL followed by loading self configuration data from the external flash. Upon release of RESETZ, all DLPC34xx I/Os will become active. Immediately following the release of RESETZ, the HOST_IRQ signal will be driven high to indicate that the auto initialization routine is in progress. However, since a pullup resistor is connected to signal HOST_IRQ, this signal will have already gone high before the controller actively drives it high. Upon completion of the auto-initialization routine, the DLPC34xx controller will drive HOST_IRQ low to indicate the initialization done state of the controller has been reached.

To ensure reliable operation, during the power-up initialization sequence, GPIO_08 (PROJ_ON) must not be deasserted. In other words, once the startup routine has begun (by asserting PROJ_ON), the startup routine must complete (indicated by HOST_IRQ going low) before the controller can be commanded off (by deasserting PROJ_ON).

Note:

No I2C or DSI (if applicable) activity is permitted until HOST_IRQ goes low.