| Orderable Device |
Status (1) |
Package Type |
Package Drawing |
Pins |
Package Qty |
Eco Plan (2) |
Lead/Ball Finish |
MSL Peak Temp (3) |
Op Temp (°C) |
Device Marking(4)(5) |
| DLPC3437CZEZ |
ACTIVE |
NFBGA |
ZEZ |
201 |
160 |
TBD |
Call TI |
Level-3-260C-168 HRS |
–30 to 85°C |
|
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new
designs.
LIFEBUY: TI has announced that the
device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs.
Device is in production to support existing customers, but TI does not recommend
using this part in a new design.
PRE_PROD
Unannounced device, not in production, not available for mass market, nor on the
web, samples not available.
PREVIEW: Device
has been announced but is not in production. Samples may or may not be
available.
OBSOLETE: TI has discontinued
the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS),
Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or
"Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not
exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at
high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder
bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free
(RoHS compatible) as defined above.
Green (RoHS
& no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible),
and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do
not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating
according to the JEDEC industry standard classifications, and peak solder
temperature.
(4) There may be additional marking, which relates to the logo, the
lot trace code information, or the environmental category on the device
(5) Multiple Device markings will be inside parentheses. Only on
Device Marking contained in parentheses and separated by a "~" will appear on a
device. If a line is indented then it is a continuation of the previous line and
the two combined represent the entire Device Marking for that device.
| Important
Information and Disclaimer: The information provided
on this page represents TI's knowledge and belief as of the
date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. TI has taken and continues
to take reasonable steps to provide representative and
accurate information but may not have conducted destructive
testing or chemical analysis on incoming materials and
chemicals. TI and TI suppliers consider certain information
to be proprietary, and thus CAS numbers and other limited
information may not be available for release. |
| In no event shall TI's
liability arising out of such information exceed the total
purchase price of the TI part(s) at issue in this document
sold by TI to Customer on an annual basis. |