ZHCSHH9D January   2017  – August 2021 DLPC3437

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillators Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
    15. 6.15 Other Timing Requirements
    16. 6.16 DMD Sub-LVDS Interface Switching Characteristics
    17. 6.17 DMD Parking Switching Characteristics
    18. 6.18 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 Parallel Interface Data Transfer Format
      2. 7.3.2 Device Start-Up
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast PARK Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PLL Power Layout
      2. 10.1.2 Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3 Unused Pins
      4. 10.1.4 DMD Control and Sub-LVDS Signals
      5. 10.1.5 Layer Changes
      6. 10.1.6 Stubs
      7. 10.1.7 Terminations
      8. 10.1.8 Routing Vias
      9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

10.1.2.1 Recommended Crystal Oscillator Configuration

Table 10-1 Crystal Port Characteristics
PARAMETER NOM UNIT
PLL_REFCLK_I TO GND capacitance 1.5 pF
PLL_REFCLK_O TO GND capacitance 1.5 pF
Table 10-2 Recommended Crystal Configuration
PARAMETER (1)(2) RECOMMENDED UNIT
Crystal circuit configuration Parallel resonant
Crystal type Fundamental (first harmonic)
Crystal nominal frequency 24 MHz
Crystal frequency tolerance (including accuracy, temperature, aging and trim sensitivity) ±200 PPM
Maximum startup time 1.0 ms
Crystal equivalent series resistance (ESR) 120 (max) Ω
Crystal load 6 pF
RS drive resistor (nominal) 100 Ω
RFB feedback resistor (nominal) 1 MΩ
CL1 external crystal load capacitor See equation in Figure 10-2 notes pF
CL2 external crystal load capacitor See equation in Figure 10-2 notes pF
PCB layout A ground isolation ring around the crystal is recommended
(1) Temperature range of –30°C to 85°C.
(2) The crystal bias is determined by the controllers VCC_INTF voltage rail, which is variable (not the VCC18 rail).

If an external oscillator is used, then the oscillator output must drive the PLL_REFCLK_I pin on the DLPC34xx controller, and the PLL_REFCLK_O pin must be left unconnected.

Table 10-3 Recommended Crystal Parts
MANUFACTURER(1)(2) PART NUMBER SPEED
(MHz)		 TEMPERATURE AND AGING
(ppm)		 MAXIMUM
ESR (Ω)		 LOAD CAPACITANCE
(pF)		 PACKAGE DIMENSIONS
(mm)
KDS DSX211G-24.000M-8pF-50-50 24 ±50 120 8 2.0 × 1.6
Murata XRCGB24M000F0L11R0 24 ±100 120 6 2.0 × 1.6
NDK NX2016SA 24M
EXS00A-CS05733		 24 ±145 120 6 2.0 × 1.6
(1) The crystal devices in this table have been validated to work with the DLPC34xx controller. Other devices may also be compatible but have not necessarily been validated by TI.
(2) Operating temperature range: –30°C to 85°C for all crystals.
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