ZHCSD20H October   2014  – June 2024 DLPC900

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 应用
4. 3 说明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Thermal Information
   5. 5.5  Electrical Characteristics
   6. 5.6  System Oscillators Timing Requirements #GUID-909D0FD3-84C7-4481-924A-4FDE7EB548A1/DLPS0373944
   7. 5.7  Power-Up and Power-Down Timing Requirements
      1. 5.7.1 Power-Up
      2. 5.7.2 Power-Down
   8. 5.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
   9. 5.9  JTAG Interface: I/O Boundary Scan Application Switching Characteristics
   10. 5.10 Programmable Output Clocks Switching Characteristics
   11. 5.11 Port 1 and 2 Input Pixel Interface Timing Requirements
   12. 5.12 Two Pixels Per Clock (48-Bit Bus) Timing Requirements
   13. 5.13 Synchronous Serial Port (SSP) Switching Characteristics
   14. 5.14 DMD Interface Switching Characteristics
   15. 5.15 DMD LVDS Interface Switching Characteristics
   16. 5.16 Source Input Blanking Requirements
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 DMD Configurations
      2. 6.3.2 Video Timing Input Blanking Specification
      3. 6.3.3 Board-Level Test Support
      4. 6.3.4 Two Controller Considerations
      5. 6.3.5 Memory Design Considerations
         1. 6.3.5.1 Flash Memory Optimization
         2. 6.3.5.2 Operating Modes
         3. 6.3.5.3 DLPC900 External Memory Space
         4. 6.3.5.4 Minimizing Memory Space
         5. 6.3.5.5 Minimizing Board Size
            1. 6.3.5.5.1 Package Selection
            2. 6.3.5.5.2 Large Density Flash
               1. 6.3.5.5.2.1 Combining Two Chip-Selects with One 32-Megabyte Flash
               2. 6.3.5.5.2.2 Combining Three Chip-Selects with One 64-Megabyte Flash
               3. 6.3.5.5.2.3 Combining Three Chip-Selects with One 128-Megabyte Flash
         6. 6.3.5.6 Minimizing Board Space
         7. 6.3.5.7 Flash Memory
   4. 6.4 Device Functional Modes
      1. 6.4.1 Structured Light Application
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Applications
      1. 7.2.1 Typical Two Controller Chipset
         1. 7.2.1.1 Design Requirements
         2. 7.2.1.2 Detailed Design Procedure
            1. 7.2.1.2.1 DLPC900 System Interfaces
               1. 7.2.1.2.1.1 Control Interface
               2. 7.2.1.2.1.2 Input Data Interfaces
               3. 7.2.1.2.1.3 DLPC900 System Output Interfaces
                  1. 7.2.1.2.1.3.1 Illumination Interface
                  2. 7.2.1.2.1.3.2 Trigger and Sync Interface
               4. 7.2.1.2.1.4 DLPC900 System Support Interfaces
                  1. 7.2.1.2.1.4.1 Reference Clock and PLL
                  2. 7.2.1.2.1.4.2 Program Memory Flash Interface
                  3. 7.2.1.2.1.4.3 DMD Interface
      2. 7.2.2 Typical Single Controller Chipset
9. 8 Power Supply Recommendations
   1. 8.1 System Power Regulation
      1. 8.1.1 Power Distribution System
         1. 8.1.1.1 1.15V System Power
         2. 8.1.1.2 1.8V System Power
         3. 8.1.1.3 3.3-V System Power
   2. 8.2 System Environment and Defaults
      1. 8.2.1 DLPC900 System Power-Up and Reset Default Conditions
   3. 8.3 System Power-Up Sequence
      1. 8.3.1 Power-On Sense (POSENSE) Support
      2. 8.3.2 Power Good (PWRGOOD) Support
      3. 8.3.3 5V Tolerant Support
   4. 8.4 System Reset Operation
      1. 8.4.1 Power-Up Reset Operation
      2. 8.4.2 System Reset Operation
10. 9 Layout
    1. 9.1 Layout Guidelines
       1. 9.1.1  General PCB Recommendations
       2. 9.1.2  PCB Layout Guidelines for Internal Controller PLL Power
       3. 9.1.3  PCB Layout Guidelines for Quality Video Performance
       4. 9.1.4  Recommended MOSC Crystal Oscillator Configuration
       5. 9.1.5  Spread Spectrum Clock Generator Support
       6. 9.1.6  GPIO Interface
       7. 9.1.7  General Handling Guidelines for Unused CMOS-Type Pins
       8. 9.1.8  DMD Interface Considerations
          1. 9.1.8.1 Flex Connector Plating
       9. 9.1.9  PCB Design Standards
       10. 9.1.10 Signal Layers
       11. 9.1.11 Trace Widths and Minimum Spacing
       12. 9.1.12 Trace Impedance and Routing Priority
       13. 9.1.13 Power and Ground Planes
       14. 9.1.14 Power Vias
       15. 9.1.15 Decoupling
       16. 9.1.16 Fiducials
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
11. 10Device and Documentation Support
    1. 10.1 Device Support
       1. 10.1.1 Device Nomenclature
       2. 10.1.2 Device Markings
       3. 10.1.3 DEFINITIONS—Video Timing Parameters
    2. 10.2 Documentation Support
       1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information