ZHCSAB9E September 2012 – June 2019 DP83848-EP
PRODUCTION DATA.
- 1 器件概述
- 2 修订历史记录
- 3 Pin Configuration and Functions
-
4 Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 ESD Ratings
- 4.3 Recommended Operating Conditions
- 4.4 Thermal Information
- 4.5 DC Specifications
- 4.6
AC Specifications
- 4.6.1 Power Up Timing
- 4.6.2 Reset Timing
- 4.6.3 MII Serial Management Timing
- 4.6.4 100-Mbps MII Transmit Timing
- 4.6.5 100-Mbps MII Receive Timing
- 4.6.6 100BASE-TX Transmit Packet Latency Timing
- 4.6.7 100BASE-TX Transmit Packet Deassertion Timing
- 4.6.8 100BASE-TX Transmit Timing (tR/F and Jitter)
- 4.6.9 100BASE-TX Receive Packet Latency Timing
- 4.6.10 100BASE-TX Receive Packet Deassertion Timing
- 4.6.11 10-Mbps MII Transmit Timing
- 4.6.12 10-Mbps MII Receive Timing
- 4.6.13 10-Mbps Serial Mode Transmit Timing
- 4.6.14 10-Mbps Serial Mode Receive Timing
- 4.6.15 10BASE-T Transmit Timing (Start of Packet)
- 4.6.16 10BASE-T Transmit Timing (End of Packet)
- 4.6.17 10BASE-T Receive Timing (Start of Packet)
- 4.6.18 10BASE-T Receive Timing (End of Packet)
- 4.6.19 10-Mbps Heartbeat Timing
- 4.6.20 10-Mbps Jabber Timing
- 4.6.21 10BASE-T Normal Link Pulse Timing
- 4.6.22 Auto-Negotiation Fast Link Pulse (FLP) Timing
- 4.6.23 100BASE-TX Signal Detect Timing
- 4.6.24 100-Mbps Internal Loopback Timing
- 4.6.25 10-Mbps Internal Loopback Timing
- 4.6.26 RMII Transmit Timing
- 4.6.27 RMII Receive Timing
- 4.6.28 Isolation Timing
- 4.6.29 25MHz_OUT Timing
-
5 Detailed Description
- 5.1 Overview
- 5.2 Functional Block Diagram
- 5.3 Feature Description
- 5.4 Device Functional Modes
- 5.5
Programming
- 5.5.1
Architecture
- 5.5.1.1 100BASE-TX Transmitter
- 5.5.1.2
100BASE-TX Receiver
- 5.5.1.2.1 Analog Front End
- 5.5.1.2.2 Digital Signal Processor
- 5.5.1.2.3 Signal Detect
- 5.5.1.2.4 MLT-3 to NRZI Decoder
- 5.5.1.2.5 NRZI to NRZ
- 5.5.1.2.6 Serial to Parallel
- 5.5.1.2.7 Descrambler
- 5.5.1.2.8 Code-group Alignment
- 5.5.1.2.9 4B/5B Decoder
- 5.5.1.2.10 100BASE-TX Link Integrity Monitor
- 5.5.1.2.11 Bad SSD Detection
- 5.5.1.3
10BASE-T Transceiver Module
- 5.5.1.3.1 Operational Modes
- 5.5.1.3.2 Smart Squelch
- 5.5.1.3.3 Collision Detection and SQE
- 5.5.1.3.4 Carrier Sense
- 5.5.1.3.5 Normal Link Pulse Detection and Generation
- 5.5.1.3.6 Jabber Function
- 5.5.1.3.7 Automatic Link Polarity Detection and Correction
- 5.5.1.3.8 Transmit and Receive Filtering
- 5.5.1.3.9 Transmitter
- 5.5.1.3.10 Receiver
- 5.5.1
Architecture
- 5.6
Memory
- 5.6.1
Register Definition
- 5.6.1.1 Basic Mode Control Register (BMCR)
- 5.6.1.2 Basic Mode Status Register (BMSR)
- 5.6.1.3 PHY Identifier Register #1 (PHYIDR1)
- 5.6.1.4 PHY Identifier Register #2 (PHYIDR2)
- 5.6.1.5 Auto-Negotiation Advertisement Register (ANAR)
- 5.6.1.6 Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
- 5.6.1.7 Auto-Negotiation Link Partner Ability Register (ANLPAR) (Next Page)
- 5.6.1.8 Auto-Negotiate Expansion Register (ANER)
- 5.6.1.9 Auto-Negotiation Next Page Transmit Register (ANNPTR)
- 5.6.2
Extended Registers
- 5.6.2.1 PHY Status Register (PHYSTS)
- 5.6.2.2 MII Interrupt Control Register (MICR)
- 5.6.2.3 MII Interrupt Status and Miscellaneous Control Register (MISR)
- 5.6.2.4 False Carrier Sense Counter Register (FCSCR)
- 5.6.2.5 Receiver Error Counter Register (RECR)
- 5.6.2.6 100 Mbps PCS Configuration and Status Register (PCSR)
- 5.6.2.7 RMII and Bypass Register (RBR)
- 5.6.2.8 LED Direct Control Register (LEDCR)
- 5.6.2.9 PHY Control Register (PHYCR)
- 5.6.2.10 10Base-T Status/Control Register (10BTSCR)
- 5.6.2.11 CD Test and BIST Extensions Register (CDCTRL1)
- 5.6.2.12 Energy Detect Control (EDCR)
- 5.6.1
Register Definition
- 6 Application and Implementation
- 7 Power Supply Recommendations
- 8 Layout
- 9 器件和文档支持
- 10机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
8.1.1 PCB Layout Considerations
Place the 49.9-Ω,1% resistors, and 0.1-µF decoupling capacitor, near the PHYTER TD± and RD± pins and via directly to the Vdd plane. Stubs should be avoided on all signal traces, especially the differential signal pairs. See Figure 8-1. Within the pairs (for example, TD+ and TD–) the trace lengths should be run parallel to each other and matched in length. Matched lengths minimize delay differences, avoiding an increase in common mode noise and increased EMI. See Figure 8-1.
Figure 8-1 Differential Signal Pair – Stubs Ideally there should be no crossover or via on the signal paths. Vias present impedance discontinuities and should be minimized. Route an entire trace pair on a single layer if possible. PCB trace lengths should be kept as short as possible. Signal traces should not be run such that they cross a plane split. See Figure 8-2. A signal crossing a plane split may cause unpredictable return path currents and would likely impact signal quality as well, potentially creating EMI problems.
Figure 8-2 Differential Signal Pair-Plane Crossing MDI signal traces should have 50 Ω to ground or 100-Ω differential controlled impedance. Many tools are available online to calculate this.