5.8.1 Package Thermal Characteristics
Table 5-20 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABC package.
Table 5-20 Thermal Resistance Characteristics
NO. |
PARAMETER |
DESCRIPTION |
°C/W(1) |
AIR FLOW (m/s)(2) |
T1 |
RΘJC |
Junction-to-case |
0.82 |
N/A |
T2 |
RΘJB |
Junction-to-board |
3.78 |
N/A |
T3 |
RΘJA |
Junction-to-free air |
11.1 |
0 |
T4 |
Junction-to-moving air |
8.8 |
1 |
T5 |
8.0 |
2 |
T6 |
7.5 |
3 |
T7 |
ΨJT |
Junction-to-package top |
0.62 |
0 |
T8 |
0.66 |
1 |
T9 |
0.66 |
2 |
T10 |
0.66 |
3 |
T11 |
ΨJB |
Junction-to-board |
3.43 |
0 |
T12 |
3.22 |
1 |
T13 |
3.12 |
2 |
T14 |
3.04 |
3 |
- These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
- JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
- JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
- JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JESD51-9, Test Boards for Area Array Surface Mount Packages
- m/s = meters per second