ZHCSP55A October   2019  – October 2021 DRV10982-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Regulators
        1. 8.3.1.1 Step-Down Regulator
        2. 8.3.1.2 3.3-V and 1.8-V LDO
      2. 8.3.2 Protection Circuits
        1. 8.3.2.1 Thermal Shutdown
        2. 8.3.2.2 Undervoltage Lockout (UVLO)
        3. 8.3.2.3 Overcurrent Protection
        4. 8.3.2.4 Lock
      3. 8.3.3 Motor Speed Control
      4. 8.3.4 Load Dump Handling
      5. 8.3.5 Sleep or Standby Condition
        1. 8.3.5.1 Required Sequence to Enter Sleep Mode
          1. 8.3.5.1.1 Option 1
          2. 8.3.5.1.2 Option 2
      6. 8.3.6 EEPROM Access
    4. 8.4 Device Functional Modes
      1. 8.4.1  Motor Parameters
        1. 8.4.1.1 Motor Phase Resistance
        2. 8.4.1.2 BEMF Constant
      2. 8.4.2  Starting the Motor Under Different Initial Conditions
        1. 8.4.2.1 Case 1 – Motor is Stationary
        2. 8.4.2.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 8.4.2.3 Case 3 – Motor is Spinning in the Reverse Direction
      3. 8.4.3  Motor Start Sequence
        1. 8.4.3.1 Initial Speed Detect
        2. 8.4.3.2 Motor Resynchronization
        3. 8.4.3.3 Reverse Drive
        4. 8.4.3.4 Motor Brake
        5. 8.4.3.5 Motor Initialization
          1. 8.4.3.5.1 Align
          2. 8.4.3.5.2 Initial Position Detect (IPD)
            1. 8.4.3.5.2.1 IPD Operation
            2. 8.4.3.5.2.2 IPD Release Mode
            3. 8.4.3.5.2.3 IPD Advance Angle
          3. 8.4.3.5.3 Motor Start
        6. 8.4.3.6 Start-Up Timing
      4. 8.4.4  Align Current
      5. 8.4.5  Start-Up Current Setting
        1. 8.4.5.1 Start-Up Current Ramp-Up
      6. 8.4.6  Closed Loop
        1. 8.4.6.1 Half-Cycle Control and Full-Cycle Control
        2. 8.4.6.2 Analog-Mode Speed Control
        3. 8.4.6.3 Digital PWM-Input-Mode Speed Control
        4. 8.4.6.4 I2C-Mode Speed Control
        5. 8.4.6.5 Closed-Loop Accelerate
        6. 8.4.6.6 Control Coefficient
        7. 8.4.6.7 Commutation Control Advance Angle
      7. 8.4.7  Current Limit
        1. 8.4.7.1 Acceleration Current Limit
      8. 8.4.8  Lock Detect and Fault Handling
        1. 8.4.8.1 Lock0: Lock-Detection Current Limit Triggered
        2. 8.4.8.2 Lock1: Abnormal Speed
        3. 8.4.8.3 Lock2: Abnormal Kt
        4. 8.4.8.4 Lock3 (Fault3): No-Motor Fault
        5. 8.4.8.5 Lock4: Open-Loop Motor-Stuck Lock
        6. 8.4.8.6 Lock5: Closed Loop Motor Stuck Lock
      9. 8.4.9  Anti Voltage Suppression Function
        1. 8.4.9.1 Mechanical AVS Function
        2. 8.4.9.2 Inductive AVS Function
      10. 8.4.10 PWM Output
      11. 8.4.11 FG Customized Configuration
        1. 8.4.11.1 FG Output Frequency
        2. 8.4.11.2 FG Open Loop and Lock Behavior
      12. 8.4.12 Diagnostics and Visibility
        1. 8.4.12.1 Motor-Status Readback
        2. 8.4.12.2 Motor-Speed Readback
        3. 8.4.12.3 Motor Electrical-Period Readback
        4. 8.4.12.4 BEMF Constant Read Back
        5. 8.4.12.5 Motor Estimated Position by IPD
        6. 8.4.12.6 Supply-Voltage Readback
        7. 8.4.12.7 Speed-Command Readback
        8. 8.4.12.8 Speed-Command Buffer Readback
        9. 8.4.12.9 Fault Diagnostics
    5. 8.5 Register Maps
      1. 8.5.1 I2C Serial Interface
      2. 8.5.2 Register Map
      3. 8.5.3 Register Descriptions
        1. 8.5.3.1  FaultReg Register (address = 0x00) [reset = 0x00]
        2. 8.5.3.2  MotorSpeed Register (address = 0x01) [reset = 0x00]
        3. 8.5.3.3  MotorPeriod Register (address = 0x02) [reset = 0x00]
        4. 8.5.3.4  MotorKt Register (address = 0x03) [reset = 0x00]
        5. 8.5.3.5  MotorCurrent Register (address = 0x04) [reset = 0x00]
        6. 8.5.3.6  IPDPosition–SupplyVoltage Register (address = 0x05) [reset = 0x00]
        7. 8.5.3.7  SpeedCmd–spdCmdBuffer Register (address = 0x06) [reset = 0x00]
        8. 8.5.3.8  AnalogInLvl Register (address = 0x07) [reset = 0x00]
        9. 8.5.3.9  DeviceID–RevisionID Register (address = 0x08) [reset = 0x00]
        10. 8.5.3.10 DeviceID–RevisionID Register (address = 0x08) [reset = 0x00]
        11. 8.5.3.11 Unused Registers (addresses = 0x011 Through 0x2F)
        12. 8.5.3.12 SpeedCtrl Register (address = 0x30) [reset = 0x00]
        13. 8.5.3.13 EEPROM Programming1 Register (address = 0x31) [reset = 0x00]
        14. 8.5.3.14 EEPROM Programming2 Register (address = 0x32) [reset = 0x00]
        15. 8.5.3.15 EEPROM Programming3 Register (address = 0x33) [reset = 0x00]
        16. 8.5.3.16 EEPROM Programming4 Register (address = 0x34) [reset = 0x00]
        17. 8.5.3.17 EEPROM Programming5 Register (address = 0x35) [reset = 0x00]
        18. 8.5.3.18 EEPROM Programming6 Register (address = 0x36) [reset = 0x00]
        19. 8.5.3.19 Unused Registers (addresses = 0x37 Through 0x5F)
        20. 8.5.3.20 EECTRL Register (address = 0x60) [reset = 0x00]
        21. 8.5.3.21 Unused Registers (addresses = 0x61 Through 0x8F)
        22. 8.5.3.22 CONFIG1 Register (address = 0x90) [reset = 0x00]
        23. 8.5.3.23 CONFIG2 Register (address = 0x91) [reset = 0x00]
        24. 8.5.3.24 CONFIG3 Register (address = 0x92) [reset = 0x00]
        25. 8.5.3.25 CONFIG4 Register (address = 0x93) [reset = 0x00]
        26. 8.5.3.26 CONFIG5 Register (address = 0x94) [reset = 0x00]
        27. 8.5.3.27 CONFIG6 Register (address = 0x95) [reset = 0x00]
        28. 8.5.3.28 CONFIG7 Register (address = 0x96) [reset = 0x00]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information
      2. 13.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13.1.1 Packaging Information

Orderable DeviceStatus (1)Package TypePackage DrawingPinsPackage QtyEco Plan (2)Lead/Ball Finish(4)MSL Peak Temp (3)Op Temp (°C)Device Marking(5)(6)
DRV10982SQPWPRQ1ACTIVEHTSSOPPWP242000Green (RoHS & no Sb/Br)NIPDAULevel-3-260C-168 HR-40 to 12510982SQ1
DRV10982QPWPRQ1ACTIVEHTSSOPPWP242000Green (RoHS & no Sb/Br)NIPDAULevel-3-260C-168 HR-40 to 125DRV10982Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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